| 74LVC4066D,112 | NXP Semiconductors | Quad bilateral switch - Description: 3.3V PicoGate Bilateral Switch ; Logic switching levels: TTL ; On resistance: 6 Ohms; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 0.3 @ 3.3 V ns; Voltage: 1.65 - 5.5 V; Package: SOT108-1 (SO14); Container: Tube |
| 74LVC4066D,118 | NXP Semiconductors | Quad bilateral switch - Description: 3.3V PicoGate Bilateral Switch ; Logic switching levels: TTL ; On resistance: 6 Ohms; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 0.3 @ 3.3 V ns; Voltage: 1.65 - 5.5 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVC4066PW,112 | NXP Semiconductors | Quad bilateral switch - Description: 3.3V PicoGate Bilateral Switch ; Logic switching levels: TTL ; On resistance: 6 Ohms; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 0.3 @ 3.3 V ns; Voltage: 1.65 - 5.5 V; Package: SOT402-1 (TSSOP14); Container: Tube |
| 74LVC4066PW,118 | NXP Semiconductors | Quad bilateral switch - Description: 3.3V PicoGate Bilateral Switch ; Logic switching levels: TTL ; On resistance: 6 Ohms; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 0.3 @ 3.3 V ns; Voltage: 1.65 - 5.5 V; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVC4245ABQ,118 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state; Package: SOT815-1 (DHVQFN24); Container: Reel Pack, SMD, 13" |
| 74LVC4245AD,112 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state - Description: 3.3V Octal Dual Supply Translating Transceiver (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4.0@3.3V ns; Voltage: 1.5-3.6/5.5; Package: SOT137-1 (SO24); Container: Tube |
| 74LVC4245AD,118 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state - Description: 3.3V Octal Dual Supply Translating Transceiver (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4.0@3.3V ns; Voltage: 1.5-3.6/5.5; Package: SOT137-1 (SO24); Container: Reel Pack, SMD, 13" |
| 74LVC4245ADB,112 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state - Description: 3.3V Octal Dual Supply Translating Transceiver (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4.0@3.3V ns; Voltage: 1.5- 3.5/5.5; Package: SOT340-1 (SSOP24); Container: Tube |
| 74LVC4245ADB,118 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state - Description: 3.3V Octal Dual Supply Translating Transceiver (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4.0@3.3V ns; Voltage: 1.5- 3.5/5.5; Package: SOT340-1 (SSOP24); Container: Reel Pack, SMD, 13" |
| 74LVC4245APW,112 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state - Description: 3.3V Octal Dual Supply Translating Transceiver (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4.0@3.3V ns; Voltage: 1.5-3.3/5.5; Package: SOT355-1 (TSSOP24); Container: Tube |
| 74LVC4245APW,118 | NXP Semiconductors | Octal dual supply translating transceiver; 3-state - Description: 3.3V Octal Dual Supply Translating Transceiver (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4.0@3.3V ns; Voltage: 1.5-3.3/5.5; Package: SOT355-1 (TSSOP24); Container: Reel Pack, SMD, 13" |
| 74LVC541ABQ,115 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT764-1 (DHVQFN20); Container: Reel Pack, SMD, 7" |
| 74LVC541AD,112 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tube |
| 74LVC541AD,118 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tape reel smd |
| 74LVC541ADB,112 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT339-1 (SSOP20); Container: Tube |
| 74LVC541APW,112 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVC541APW,118 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVC573ABQ,115 | NXP Semiconductors | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.4@3.3V ns; Voltage: 1.2-3.6; Package: SOT764-1 (DHVQFN20); Container: Reel Pack, SMD, 7" |
| 74LVC573AD,112 | NXP Semiconductors | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.4@3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tube |
| 74LVC573AD,118 | NXP Semiconductors | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.4@3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tape reel smd |
| 74LVC573ADB,118 | NXP Semiconductors | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.4@3.3V ns; Voltage: 1.2-3.6; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVC573APW,112 | NXP Semiconductors | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.4@3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVC573APW,118 | NXP Semiconductors | Octal D-type transparent latch with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.4@3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVC574ABQ,115 | NXP Semiconductors | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) - Description: 3.3V Octal D-Type Flip-Flop ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT764-1 (DHVQFN20); Container: Reel Pack, SMD, 7" |
| 74LVC574AD,112 | NXP Semiconductors | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) - Description: 3.3V Octal D-Type Flip-Flop ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tube |
| 74LVC574AD,118 | NXP Semiconductors | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) - Description: 3.3V Octal D-Type Flip-Flop ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tape reel smd |
| 74LVC574ADB,118 | NXP Semiconductors | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) - Description: 3.3V Octal D-Type Flip-Flop ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVC574APW,112 | NXP Semiconductors | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) - Description: 3.3V Octal D-Type Flip-Flop ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVC574APW,118 | NXP Semiconductors | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger (3-state) - Description: 3.3V Octal D-Type Flip-Flop ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVC594ABQ,115 | NXP Semiconductors | 8-bit shift register with output register; Package: SOT763-1 (DHVQFN16); Container: Reel Pack, SMD, 7" |
| 74LVC594APW,118 | NXP Semiconductors | 8-bit shift register with output register; Package: SOT403-1 (TSSOP16); Container: Reel Pack, SMD, 13" |
| 74LVC595ABQ,115 | NXP Semiconductors | 8-bit serial-in/serial-out or parallel-out shift register; 3-state; Package: SOT763-1 (DHVQFN16); Container: Reel Pack, SMD, 7" |
| 74LVC595AD,112 | NXP Semiconductors | 8-bit serial-in/serial-out or parallel-out shift register; 3-state; Package: SOT109-1 (SO16); Container: Tube |
| 74LVC595AD,118 | NXP Semiconductors | 8-bit serial-in/serial-out or parallel-out shift register; 3-state; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13" |
| 74LVC595APW,112 | NXP Semiconductors | 8-bit serial-in/serial-out or parallel-out shift register; 3-state; Package: SOT403-1 (TSSOP16); Container: Tube |
| 74LVC595APW,118 | NXP Semiconductors | 8-bit serial-in/serial-out or parallel-out shift register; 3-state; Package: SOT403-1 (TSSOP16); Container: Reel Pack, SMD, 13" |
| 74LVC74ABQ,115 | NXP Semiconductors | Dual D-type flip-flop with set and reset; positive-edge trigger - Description: 3.3V Dual D-Type Flip-Flop with Set and Reset; Positive-Edge Trigger ; F<sub>max</sub>: 250 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.5 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT762-1 (DHVQFN14); Container: Reel Pack, SMD, 7" |
| 74LVC74AD,112 | NXP Semiconductors | Dual D-type flip-flop with set and reset; positive-edge trigger - Description: 3.3V Dual D-Type Flip-Flop with Set and Reset; Positive-Edge Trigger ; F<sub>max</sub>: 250 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.5 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT108-1 (SO14); Container: Tube |
| 74LVC74AD,118 | NXP Semiconductors | Dual D-type flip-flop with set and reset; positive-edge trigger - Description: 3.3V Dual D-Type Flip-Flop with Set and Reset; Positive-Edge Trigger ; F<sub>max</sub>: 250 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.5 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVC74ADB,118 | NXP Semiconductors | Dual D-type flip-flop with set and reset; positive-edge trigger - Description: 3.3V Dual D-Type Flip-Flop with Set and Reset; Positive-Edge Trigger ; F<sub>max</sub>: 250 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.5 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT337-1 (SSOP14); Container: Reel Pack, SMD, 13" |
| 74LVC74APW,112 | NXP Semiconductors | Dual D-type flip-flop with set and reset; positive-edge trigger - Description: 3.3V Dual D-Type Flip-Flop with Set and Reset; Positive-Edge Trigger ; F<sub>max</sub>: 250 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.5 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT402-1 (TSSOP14); Container: Tube |
| 74LVC74APW,118 | NXP Semiconductors | Dual D-type flip-flop with set and reset; positive-edge trigger - Description: 3.3V Dual D-Type Flip-Flop with Set and Reset; Positive-Edge Trigger ; F<sub>max</sub>: 250 MHz; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.5 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVC827APW,112 | NXP Semiconductors | 10-bit buffer/line driver with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V 10-Bit Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4@3.3V ns; Voltage: 1.2-3.6; Package: SOT355-1 (TSSOP24); Container: Tube |
| 74LVC827APW,118 | NXP Semiconductors | 10-bit buffer/line driver with 5 V tolerant inputs/outputs; 3-state - Description: 3.3V 10-Bit Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 4@3.3V ns; Voltage: 1.2-3.6; Package: SOT355-1 (TSSOP24); Container: Reel Pack, SMD, 13" |
| 74LVC86AD,112 | NXP Semiconductors | Quad 2-input EXCLUSIVE-OR gate - Description: 3.3V Quad 2-Input EXCLUSIVE-OR Gate ; Logic switching levels: TTL ; Output drive capability: +/-24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.0 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT108-1 (SO14); Container: Tube |
| 74LVC86AD,118 | NXP Semiconductors | Quad 2-input EXCLUSIVE-OR gate - Description: 3.3V Quad 2-Input EXCLUSIVE-OR Gate ; Logic switching levels: TTL ; Output drive capability: +/-24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.0 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVC86ADB,118 | NXP Semiconductors | Quad 2-input EXCLUSIVE-OR gate - Description: 3.3V Quad 2-Input EXCLUSIVE-OR Gate ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.0 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT337-1 (SSOP14); Container: Reel Pack, SMD, 13" |
| 74LVC86APW,112 | NXP Semiconductors | Quad 2-input EXCLUSIVE-OR gate - Description: 3.3V Quad 2-Input EXCLUSIVE-OR Gate ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.0 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT402-1 (TSSOP14); Container: Tube |
| 74LVC86APW,118 | NXP Semiconductors | Quad 2-input EXCLUSIVE-OR gate - Description: 3.3V Quad 2-Input EXCLUSIVE-OR Gate ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.0 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVC8T245BQ,118 | NXP Semiconductors | TXRX 8BIT TRANSLATING DHVQFN24 |
| 74LVC8T245BQ-Q100J | NXP Semiconductors | 74LVC8T245BQ-Q100 - 74LVC8T245BQ-Q100 - 8-bit dual supply translating transceiver; 3-state |
| 74LVC8T245PW,118 | NXP Semiconductors | TXRX 8BIT TRANSLATING 24TSSOP |
| 74LVC8T245PW-Q100J | NXP Semiconductors | 74LVC8T245PW-Q100 - 74LVC8T245PW-Q100 - 8-bit dual supply translating transceiver; 3-state |
| 74LVCH162244ADGG,1 | NXP Semiconductors | 16-bit buffer/line driver; 30 Ohm series termination resistors; 5 V tolerant input/output; 3-state - Description: 3.3V 16-Bit Buffer/Line Driver; Non-Inverting with Bus Hold and 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.9@3.3V ns; Voltage: 1.2-3.6; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVCH162244ADL:11 | NXP Semiconductors | 16-bit buffer/line driver; 30 Ohm series termination resistors; 5 V tolerant input/output; 3-state - Description: 3.3V 16-Bit Buffer/Line Driver; Non-Inverting with Bus Hold and 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.9@3.3V ns; Voltage: 1.2-3.6; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVCH162245ADGG:1 | NXP Semiconductors | 16-bit transceiver with direction pin, 30 Ohm series termination resistors; 5 V tolerant input/output; 3-state - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold and 30 ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVCH162245ADL,11 | NXP Semiconductors | 16-bit transceiver with direction pin, 30 Ohm series termination resistors; 5 V tolerant input/output; 3-state - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold and 30 ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.3@3.3V ns; Voltage: 1.2-3.6; Package: SOT370-1 (SSOP48); Container: Tube |
| 74LVCH162373ADGG:1 | NXP Semiconductors | 16-bit D-type transparent latch; 30 Ohm series termination resistors; 5 V tolerant inputs/outputs; 3-state - Description: 3.3V 16-Bit D-Type Transparent Latch with Bus Hold and 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@3.3V ns; Voltage: 1.2-3.6; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVCH16244ADGG-QJ | NXP Semiconductors | 74LVCH16244ADGG-Q100 - 74LVCH16244ADGG-Q100 - 16-bit buffer/line driver; 5 V input/output tolerant; 3-state |
| 74LVCH16245ADGG,11 | NXP Semiconductors | 74LVCH16245 - IC LVC/LCX/Z SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48, 6.10 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT362-1, TSSOP-48, Bus Driver/Transceiver |
| 74LVCH16245ADGG-QJ | NXP Semiconductors | 74LVCH16245ADGG-Q100 - 74LVCH16245ADGG-Q100 - 16-bit bus transceiver with direction pin; 5 V tolerant; 3-state |
| 74LVCH16245ADL,118 | NXP Semiconductors | 74LVCH16245 - IC LVC/LCX/Z SERIES, DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48, 7.50 MM, ROHS COMPLIANT, PLASTIC, MO-118, SOT370-1, SSOP-48, Bus Driver/Transceiver |
| 74LVCH16374ADGG-QJ | NXP Semiconductors | 74LVCH16374ADGG-Q100 - 74LVCH16374ADGG-Q100 - 16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state |
| 74LVCH1T45GF,132 | NXP Semiconductors | IC IC,BUS TRANSCEIVER,SINGLE,1-BIT,LCX/LVC-CMOS,LLCC,6PIN,PLASTIC, Bus Driver/Transceiver |
| 74LVCH1T45GM,132 | NXP Semiconductors | IC IC,BUS TRANSCEIVER,SINGLE,1-BIT,LCX/LVC-CMOS,LLCC,6PIN,PLASTIC, Bus Driver/Transceiver |
| 74LVCH1T45GW,125 | NXP Semiconductors | IC IC,BUS TRANSCEIVER,SINGLE,1-BIT,LCX/LVC-CMOS,TSSOP,6PIN,PLASTIC, Bus Driver/Transceiver |
| 74LVCH244AD,118 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.8 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT163-1 (SO20); Container: Tape reel smd |
| 74LVCH244APW,112 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.8 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVCH244APW,118 | NXP Semiconductors | Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.8 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVCH245APW,118 | NXP Semiconductors | Octal bus transceiver with direction pin with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.9 @ 3.3V ns; Voltage: 1.2-3.6; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVCH2T45DC,125 | NXP Semiconductors | Dual-supply translating transceiver; 3-state, SOT765-1 (VSSOP8), Reel Pack, Reverse |
| 74LVCH2T45DC-Q100H | NXP Semiconductors | Logic - Translators, Integrated Circuits (ICs), IC TXRX TRANSLATING 3-ST 8VSSOP |
| 74LVCH2T45GM,125 | NXP Semiconductors | Dual-supply translating transceiver; 3-state, SOT902-1 (XQFN8U), Reel Pack, Reverse |
| 74LVCH2T45GT,115 | NXP Semiconductors | Dual-supply translating transceiver; 3-state, SOT833-1 (XSON8U), Reel Pack, SMD, 7" |
| 74LVCH8T245BQ,118 | NXP Semiconductors | TXRX 8BIT TRANSLATING DHVQFN24 |
| 74LVCH8T245BQ-Q10J | NXP Semiconductors | 74LVCH8T245BQ-Q100 - 74LVCH8T245BQ-Q100 - 8-bit dual supply translating transceiver; 3-state |
| 74LVCH8T245PW,118 | NXP Semiconductors | TXRX 8BIT TRANSLATING 24TSSOP |
| 74LVCU04ABQ,115 | NXP Semiconductors | Hex inverter - Description: Hex Inverter (Unbuffered) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.7@3.3V ns; Voltage: 1.2-3.6; Package: SOT762-1 (DHVQFN14); Container: Reel Pack, SMD, 7" |
| 74LVCU04AD,118 | NXP Semiconductors | Hex inverter - Description: Hex Inverter (Unbuffered) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.7@3.3V ns; Voltage: 1.2-3.6; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVCU04APW,118 | NXP Semiconductors | Hex inverter - Description: Hex Inverter (Unbuffered) ; Logic switching levels: TTL ; Output drive capability: +/- 24 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 2.7@3.3V ns; Voltage: 1.2-3.6; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVT02PW,112 | NXP Semiconductors | 74LVT02 - IC LVT SERIES, QUAD 2-INPUT NOR GATE, PDSO14, PLASTIC, SOT-402, TSSOP-14, Gate |
| 74LVT04D,118 | NXP Semiconductors | 3.3 V Hex inverter |
| 74LVT04PW,112 | NXP Semiconductors | 74LVT04 - IC LVT SERIES, HEX 1-INPUT INVERT GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14, Gate |
| 74LVT08D,112 | NXP Semiconductors | 74LVT08 - IC LVT SERIES, QUAD 2-INPUT AND GATE, PDSO14, PLASTIC, SO-14, Gate |
| 74LVT08DB,112 | NXP Semiconductors | 74LVT08 - IC LVT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 5.30 MM, PLASTIC, SSOP-14, Gate |
| 74LVT08PW,112 | NXP Semiconductors | 74LVT08 - IC LVT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, TSSOP-14, Gate |
| 74LVT125BQ,115 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT762-1 (DHVQFN14); Container: Reel Pack, SMD, 7" |
| 74LVT125D,112 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Tube |
| 74LVT125D,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVT125DB,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT337-1 (SSOP14); Container: Reel Pack, SMD, 13" |
| 74LVT125PW,112 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Tube |
| 74LVT125PW,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVT126BQ,115 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active HIGH Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT762-1 (DHVQFN14); Container: Reel Pack, SMD, 7" |
| 74LVT126D,112 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active HIGH Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Tube |
| 74LVT126D,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active HIGH Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVT126PW,112 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active HIGH Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Tube |
| 74LVT126PW,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active HIGH Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVT14D,112 | NXP Semiconductors | 3.3 V hex inverter Schmitt trigger - Description: 3.3V Hex Inverter Schmitt-Trigger ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 3.8@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Tube |
| 74LVT14D,118 | NXP Semiconductors | 3.3 V hex inverter Schmitt trigger - Description: 3.3V Hex Inverter Schmitt-Trigger ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 3.8@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVT14DB,112 | NXP Semiconductors | 3.3 V hex inverter Schmitt trigger - Description: 3.3V Hex Inverter Schmitt-Trigger ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 3.8@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT337-1 (SSOP14); Container: Tube |
| 74LVT14PW,112 | NXP Semiconductors | 3.3 V hex inverter Schmitt trigger - Description: 3.3V Hex Inverter Schmitt-Trigger ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 3.8@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Tube |
| 74LVT14PW,118 | NXP Semiconductors | 3.3 V hex inverter Schmitt trigger - Description: 3.3V Hex Inverter Schmitt-Trigger ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 3.8@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVT162244BDL,118 | NXP Semiconductors | 3.3 V 16-bit buffer/driver with 30 Ohm termination resistors - Description: 3.3V 16-Bit Buffer/Line Driver; Non-Inverting with 30 Ohm Termination Resistors ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Propagation delay: 2.8@3.3V ns; Voltage: 2.7-3.6; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVT162245BDGG:11 | NXP Semiconductors | 3.3V LVT 16-bit transceiver with 30Ohm termination resistors (3- - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold and 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Propagation delay: 2.5@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVT162245BDL,118 | NXP Semiconductors | 3.3V LVT 16-bit transceiver with 30Ohm termination resistors (3- - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold and 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: +/- 12 mA ; Propagation delay: 2.5@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVT16240ADGG,118 | NXP Semiconductors | 3.3 V LVT 16-bit inverting buffer/driver (3-State) - Description: 3.3V 16-Bit Buffer/Line Driver; Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 2@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVT16244BDGG,118 | NXP Semiconductors | 3.3 V 16-bit buffer/driver; 3-state, SOT362-1 (TSSOP48), Reel Pack, SMD, 13" |
| 74LVT16244BDL,112 | NXP Semiconductors | 3.3 V 16-bit buffer/driver; 3-state, SOT370-1 (SSOP48), Tube |
| 74LVT16245BDGG,118 | NXP Semiconductors | 3.3 V 16-bit transceiver; 3-state - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 1.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVT16245BDL,112 | NXP Semiconductors | 3.3 V 16-bit transceiver; 3-state - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 1.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT370-1 (SSOP48); Container: Tube |
| 74LVT16245BDL,118 | NXP Semiconductors | 3.3 V 16-bit transceiver; 3-state - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 1.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVT16373ADGG,118 | NXP Semiconductors | 3.3V LVT 16-bit transparent D-type latch (3-State) - Description: 3.3V 16-Bit D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 1.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVT16373ADL,118 | NXP Semiconductors | 3.3V LVT 16-bit transparent D-type latch (3-State) - Description: 3.3V 16-Bit D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 1.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVT16374ADGG,118 | NXP Semiconductors | 3.3V LVT 16-bit edge-triggered D-type flip-flop (3-State) - Description: 3.3V 16-Bit D-Type Flip-Flop; Postive-Edge Trigger with Bus Hold (3-State) ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 3@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT362-1 (TSSOP48); Container: Reel Pack, SMD, 13" |
| 74LVT16374ADL,118 | NXP Semiconductors | 3.3V LVT 16-bit edge-triggered D-type flip-flop (3-State) - Description: 3.3V 16-Bit D-Type Flip-Flop; Postive-Edge Trigger with Bus Hold (3-State) ; F<sub>max</sub>: 150 MHz; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 3@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVT2244DB,118 | NXP Semiconductors | 3.3V Octal buffer/line driver with 30Ohm series termination resistors (3-State) - Description: 3.3V Buffer/Line Driver; Non-Inverting with 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 12 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT2244PW,118 | NXP Semiconductors | 3.3V Octal buffer/line driver with 30Ohm series termination resistors (3-State) - Description: 3.3V Buffer/Line Driver; Non-Inverting with 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 12 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT2245PW,112 | NXP Semiconductors | 3.3 V octal transceiver with 30 Ohm termination resistors; 3-state - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold and 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 12 mA ; Propagation delay: 3.2@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVT241PW,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.8@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT244ABQ,115 | NXP Semiconductors | 74LVT244 - IC LVT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20, Bus Driver/Transceiver |
| 74LVT244ABQ-Q100X | NXP Semiconductors | Logic - Buffers, Drivers, Receivers, Transceivers, Integrated Circuits (ICs), IC BUFF/DVR TRI-ST DUAL 20DHVQFN |
| 74LVT244AD,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT163-1 (SO20); Container: Tape reel smd |
| 74LVT244ADB,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT244APW,112 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVT244APW,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT244BDB,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT244BPW,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT245BBQ,115 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT764-1 (DHVQFN20); Container: Reel Pack, SMD, 7" |
| 74LVT245BDB,118 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT245BPW,118 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT245BQ,115 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT764-1 (DHVQFN20); Container: Reel Pack, SMD, 7" |
| 74LVT245D,112 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT163-1 (SO20); Container: Tube |
| 74LVT245D,118 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT163-1 (SO20); Container: Tape reel smd |
| 74LVT245DB,118 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT245PW,112 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Tube |
| 74LVT245PW,118 | NXP Semiconductors | 3.3 V octal transceiver with direction pin (3-state) - Description: 3.3V Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT573DB,118 | NXP Semiconductors | 3.3 V Octal D-type transparent latch (3-State) - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.7@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT573PW,118 | NXP Semiconductors | 3.3 V Octal D-type transparent latch (3-State) - Description: 3.3V Octal D-Type Transparent Latch (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.7@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVT640D,112 | NXP Semiconductors | 3.3V Octal transceiver with direction pin; inverting (3-State) - Description: 3.3V Transceiver with Direction Pin; Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT163-1 (SO20); Container: Tube |
| 74LVT640DB,112 | NXP Semiconductors | 3.3V Octal transceiver with direction pin; inverting (3-State) - Description: 3.3V Transceiver with Direction Pin; Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.4@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Tube |
| 74LVTH125D,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| 74LVTH125PW,118 | NXP Semiconductors | 3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| 74LVTH16245BDL,118 | NXP Semiconductors | 3.3 V 16-bit transceiver; 3-state - Description: 3.3V 16-Bit Transceiver with Direction Pin; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 48 ; Output drive capability: -32/+64 mA ; Propagation delay: 1.9@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT370-1 (SSOP48); Container: Tape reel smd |
| 74LVTH244ABQ-Q100X | NXP Semiconductors | Logic - Buffers, Drivers, Receivers, Transceivers, Integrated Circuits (ICs), IC BUFF/DVR TRI-ST DUAL 20DHVQFN |
| 74LVTH244ADB,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVTH244APW,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT360-1 (TSSOP20); Container: Reel Pack, SMD, 13" |
| 74LVTH244APW-Q100J | NXP Semiconductors | 74LVTH244APW-Q100 - 74LVTH244APW-Q100 - 3.3 V octal buffer/line driver; 3-state |
| 74LVTH244BDB,118 | NXP Semiconductors | 3.3 V octal buffer/line driver; 3-state - Description: 3.3V Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2@3.3V ns; Voltage: 2.7-3.6 V; Package: SOT339-1 (SSOP20); Container: Reel Pack, SMD, 13" |
| 74LVTN16244BDGG,11 | NXP Semiconductors | IC IC,BUFFER/DRIVER,QUAD,4-BIT,LVT/ALVT-BICMOS,TSSOP,48PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHC02BQ,115 | NXP Semiconductors | 74VHC02 - Quad 2-input NOR gate, SOT762-1 (DHVQFN14) Reel Pack, SMD, 7" Standard Marking |
| 74VHC02D,118 | NXP Semiconductors | 74VHC02 - Quad 2-input NOR gate, SOT108-1 (SO14) Reel Pack, SMD, 13" Standard Marking |
| 74VHC02PW,118 | NXP Semiconductors | 74VHC02 - Quad 2-input NOR gate, SOT402-1 (TSSOP14) Reel Pack, SMD, 13" Standard Marking |
| 74VHC08BQ,115 | NXP Semiconductors | 74VHC08 - Quad 2-input AND gate, SOT762-1 (SHVQFN14, Reel Pack, SMD, 7" |
| 74VHC08D,118 | NXP Semiconductors | 74VHC08 - Quad 2-input AND gate, SOT108-1 (SO14, Reel Pack, SMD, 13" |
| 74VHC08PW,118 | NXP Semiconductors | 74VHC08 - Quad 2-input AND gate, SOT402-1 (RSSOP14), Reel Pack, SMD, 7" |
| 74VHC125BQ,115 | NXP Semiconductors | 74VHC125 - Quad buffer/line driver; 3-state, SOT762-1 (DHVQFN14) Reel Pack, SMD, 7" |
| 74VHC125D,118 | NXP Semiconductors | 74VHC125 - Quad buffer/line driver; 3-state, SOT108-1 (SO14), Reel Pack, SMD, 13" |
| 74VHC125PW,118 | NXP Semiconductors | 74VHC125 - Quad buffer/line driver; 3-state, SOT402-1 (TSSOP14) Reel Pack, SMD, 13" |
| 74VHC126BQ,115 | NXP Semiconductors | 74VHC126 - Quad buffer/line driver; 3-state, SOT762-1 (DHVQFN14), Reel Pack, SMD, 7" |
| 74VHC126D,118 | NXP Semiconductors | 74VHC126 - Quad buffer/line driver; 3-state, SOT108-1 (SO14), Reel Pack, SMD, 13" |
| 74VHC126PW,118 | NXP Semiconductors | 74VHC126 - Quad buffer/line driver; 3-state, SOT402-1 (TSSOP14), Reel Pack, SMD, 13" |
| 74VHC14BQ,115 | NXP Semiconductors | IC IC,LOGIC GATE,HEX INVERTER,AHC/VHC-CMOS,LLCC,14PIN,PLASTIC, Gate |
| 74VHC14D,118 | NXP Semiconductors | IC IC,LOGIC GATE,HEX INVERTER,AHC/VHC-CMOS,SOP,14PIN,PLASTIC, Gate |
| 74VHC14PW,118 | NXP Semiconductors | IC IC,LOGIC GATE,HEX INVERTER,AHC/VHC-CMOS,TSSOP,14PIN,PLASTIC, Gate |
| 74VHC244BQ,115 | NXP Semiconductors | IC IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,LLCC,20PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHC244D,118 | NXP Semiconductors | IC IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,SOP,20PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHC244PW,118 | NXP Semiconductors | IC IC,BUFFER/DRIVER,DUAL,4-BIT,AHC/VHC-CMOS,TSSOP,20PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHC245BQ,115 | NXP Semiconductors | TXRX OCTAL BUS 3ST 20DHVQFN |
| 74VHC245D,118 | NXP Semiconductors | TXRX OCTAL BUS 3ST 20SOIC |
| 74VHC245PW,118 | NXP Semiconductors | TXRX OCTAL BUS 3ST 20TSSOP |
| 74VHC32BQ,115 | NXP Semiconductors | IC GATE OR QUAD 2INPUT 14DHVQFN |
| 74VHC32D,118 | NXP Semiconductors | IC GATE OR QUAD 2INPUT 14SOIC |
| 74VHC32PW,118 | NXP Semiconductors | IC GATE OR QUAD 2INPUT 14TSSOP |
| 74VHC541BQ,115 | NXP Semiconductors | 74VHC541 - IC AHC/VHC/H/U/V SERIES, 1-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-241, SOT764-1, DHVQFN-20, Bus Driver/Transceiver |
| 74VHC541D,118 | NXP Semiconductors | 74VHC541 - IC AHC/VHC/H/U/V SERIES, OCTAL 1-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, ROHS COMPLIANT, PLASTIC, MS-013, SOT163-1, SOP-20, Bus Driver/Transceiver |
| 74VHC541PW,118 | NXP Semiconductors | 74VHC541 - IC AHC/VHC/H/U/V SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT360-1, TSSOP-20, Bus Driver/Transceiver |
| 74VHC595BQ,115 | NXP Semiconductors | IC SHIFT REG 8BIT SISO 16DHVQFN |
| 74VHC595D,118 | NXP Semiconductors | IC SHIFT REG 8BIT SISO 16SOIC |
| 74VHC595PW,118 | NXP Semiconductors | IC SHIFT REG 8BIT SISO 16TSSOP |
| 74VHCT02BQ,115 | NXP Semiconductors | 74VHCT02 - Quad 2-input NOR gate, SOT762-1 (DHVQFN14) Reel Pack, SMD, 7" Standard Marking |
| 74VHCT02D,118 | NXP Semiconductors | 74VHCT02 - Quad 2-input NOR gate, SOT108-1 (SO14) Reel Pack, SMD, 13" Standard Marking |
| 74VHCT02PW,118 | NXP Semiconductors | 74VHCT02 - Quad 2-input NOR gate, SOT402-1 (TSSOP14) Reel Pack, SMD, 13" Standard Marking |
| 74VHCT08BQ,115 | NXP Semiconductors | 74VHCT08 - Quad 2-input AND gate, SOT762-1 (SHVQFN14, Reel Pack, SMD, 7" |
| 74VHCT08D,118 | NXP Semiconductors | 74VHCT08 - Quad 2-input AND gate, SOT108-1 (SO14, Reel Pack, SMD, 13" |
| 74VHCT08PW,118 | NXP Semiconductors | 74VHCT08 - Quad 2-input AND gate, SOT402-1 (RSSOP14), Reel Pack, SMD, 7" |
| 74VHCT125BQ,115 | NXP Semiconductors | 74VHCT125 - Quad buffer/line driver; 3-state, SOT762-1 (DHVQFN14), Reel Pack, SMD, 7" |
| 74VHCT125D,118 | NXP Semiconductors | 74VHCT125 - Quad buffer/line driver; 3-state, SOT108-1 (SO14) Reel Pack, SMD, 13" |
| 74VHCT125PW,118 | NXP Semiconductors | 74VHCT125 - Quad buffer/line driver; 3-state, SOT402-1 (TSSOP14), Reel Pack, SMD, 13" |
| 74VHCT126BQ,115 | NXP Semiconductors | 74VHCT126 - Quad buffer/line driver; 3-state, SOT762-1 (DHVQFN14), Reel Pack, SMD, 7" |
| 74VHCT126D,118 | NXP Semiconductors | 74VHCT126 - Quad buffer/line driver; 3-state, SOT108-1 (SO14), Reel Pack, SMD, 13" |
| 74VHCT126PW,118 | NXP Semiconductors | 74VHCT126 - Quad buffer/line driver; 3-state, SOT402-1 (TSSOP14), Reel Pack, SMD, 13" |
| 74VHCT14BQ,115 | NXP Semiconductors | IC IC,LOGIC GATE,HEX INVERTER,AHCT/VHCT-CMOS,LLCC,14PIN,PLASTIC, Gate |
| 74VHCT14D,118 | NXP Semiconductors | IC IC,LOGIC GATE,HEX INVERTER,AHCT/VHCT-CMOS,SOP,14PIN,PLASTIC, Gate |
| 74VHCT14PW,118 | NXP Semiconductors | IC IC,LOGIC GATE,HEX INVERTER,AHCT/VHCT-CMOS,TSSOP,14PIN,PLASTIC, Gate |
| 74VHCT244BQ,115 | NXP Semiconductors | IC IC,BUFFER/DRIVER,DUAL,4-BIT,AHCT/VHCT-CMOS,LLCC,20PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHCT244D,118 | NXP Semiconductors | IC IC,BUFFER/DRIVER,DUAL,4-BIT,AHCT/VHCT-CMOS,SOP,20PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHCT244PW,118 | NXP Semiconductors | IC IC,BUFFER/DRIVER,DUAL,4-BIT,AHCT/VHCT-CMOS,TSSOP,20PIN,PLASTIC, Bus Driver/Transceiver |
| 74VHCT245BQ,115 | NXP Semiconductors | TXRX OCTAL BUS 3ST 20DHVQFN |
| 74VHCT245D,118 | NXP Semiconductors | TXRX OCTAL BUS 3ST 20SOIC |
| 74VHCT245PW,118 | NXP Semiconductors | TXRX OCTAL BUS 3ST 20TSSOP |
| 74VHCT32BQ,115 | NXP Semiconductors | IC GATE OR QUAD 2INPUT 14DHVQFN |
| 74VHCT32D,118 | NXP Semiconductors | IC GATE OR QUAD 2INPUT 14SOIC |
| 74VHCT32PW,118 | NXP Semiconductors | IC GATE OR QUAD 2INPUT 14TSSOP |
| 74VHCT541BQ,115 | NXP Semiconductors | 74VHCT541 - IC AHCT/VHCT/VT SERIES, 1-BIT DRIVER, TRUE OUTPUT, PQCC20, 2.50 X 4.50 MM, 0.85 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-241, SOT764-1, DHVQFN-20, Bus Driver/Transceiver |
| 74VHCT541D,118 | NXP Semiconductors | 74VHCT541 - IC AHCT/VHCT/VT SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO20, 7.50 MM, ROHS COMPLIANT, PLASTIC, MS-013, SOT163-1, SOP-20, Bus Driver/Transceiver |
| 74VHCT541PW,118 | NXP Semiconductors | 74VHCT541 - IC AHCT/VHCT/VT SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO20, 4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, SOT360-1, TSSOP-20, Bus Driver/Transceiver |
| 74VHCT595BQ,115 | NXP Semiconductors | IC SHIFT REG 8BIT SISO 16DHVQFN |
| 74VHCT595D,118 | NXP Semiconductors | IC SHIFT REG 8BIT SISO 16SOIC |
| 74VHCT595PW,118 | NXP Semiconductors | IC SHIFT REG 8BIT SISO 16TSSOP |
| BA277,115 | NXP Semiconductors | Band-switching diode - C<sub>d</sub> typ.: 1.2@VR=6V AND F=1MHz max pF; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=2 mA AND F=100 MHz max: 0.7 Ohm; V<sub>R</sub> max: 35 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BA278,115 | NXP Semiconductors | Band-switching diode - C<sub>d</sub> typ.: 1.2@VR=6V AND F=1MHz max pF; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=2 mA AND F=100 MHz max: 0.7 Ohm; V<sub>R</sub> max: 35 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BA591,115 | NXP Semiconductors | Band-switching diode - C<sub>d</sub> typ.: 0.9@VR=3V AND F=1MHz max pF; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=3 mA AND F=100 MHz max: 0.7 Ohm; R<sub>D</sub> @ I<sub>F</sub>=3 mA AND F=200 MHz max: 0.7 Ohm; V<sub>R</sub> max: 35 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BA891,115 | NXP Semiconductors | Band-switching diode - C<sub>d</sub> typ.: 0.9@VR=3V AND F=1MHz max pF; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=3 mA AND F=100 MHz max: 0.7 Ohm; R<sub>D</sub> @ I<sub>F</sub>=3 mA AND F=200 MHz max: 0.7 Ohm; V<sub>R</sub> max: 35 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAL74,215 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 100@VR=50V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 50 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAP1321-04,215 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.275@VR=20V AND F=1MHz max0.375@VR=1V and F=1MHz0.42@VR=0V and F=1MHz pF; Configuration: Series ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 5 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 1.8 Ohm; R<sub>d</sub> NOTE1: 3.5 Ohm; R<sub>d</sub> NOTE2: 1.2 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.5 ; V<sub>R</sub> max: 100 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAP50-03,115 | NXP Semiconductors | General purpose PIN diode - C<sub>d</sub> typ.: 0.35@VR=5V AND F=1MHz max0.55@VR=1V and F=1MHz0.4@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 5 Ohm; R<sub>d</sub> NOTE2: 0.9 Ohm; t<sub>L</sub> NOTE6: 0.17 µs; V<sub>R</sub> max: 50 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAP50-04W,115 | NXP Semiconductors | General purpose PIN diode - C<sub>d</sub> typ.: 0.5@VR=5V AND F=1MHz max0.45@VR=0V AND F=1MHz0.6@VR=1V AND F=1MHz max pF; Configuration: Series ; I<sub>F</sub> max: 50 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 5 Ohm; R<sub>d</sub> NOTE1: 25 Ohm; R<sub>d</sub> NOTE2: 3 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.05 ; t<sub>L</sub> NOTE6: 1.04 µs; V<sub>R</sub> max: 50 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAP50-05,215 | NXP Semiconductors | General purpose PIN diode - C<sub>d</sub> typ.: 0.5@VR=5V AND F=1MHz max0.45@VR=0V AND F=1MHz0.6@VR=1V AND F=1MHz max pF; Configuration: Common cathode ; I<sub>F</sub> max: 50 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 5 Ohm; R<sub>d</sub> NOTE1: 25 Ohm; R<sub>d</sub> NOTE2: 3 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.05 ; t<sub>L</sub> NOTE6: 1.04 µs; V<sub>R</sub> max: 50 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAP51-02,115 | NXP Semiconductors | General purpose PIN diode - Application: Wireless ; C<sub>d</sub> typ.: 0.35@VR=5V and F=1MHz max0.4@VR=0V and F=1MHz0.55@VR=1V and F=1MHz max pF; Configuration: Single ; Diode type: General Purpose PINs ; Function: Diodes ; I<sub>F</sub> max: 60 mA; Number of pins: 2 ; Power dissipation: 715 mW; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 9 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 2.5 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.55 ; V<sub>R</sub> max: 60 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAP51-03,115 | NXP Semiconductors | General purpose PIN diode - C<sub>d</sub> typ.: 0.35@VR=5V AND F=1MHz max0.4@VR=0V AND F=1MHz0.55@VR=1V AND F=1MHz max pF; Configuration: Single ; I<sub>F</sub> max: 60 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 9 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 2.5 Ohm; R<sub>d</sub> NOTE1: 5.5 Ohm; R<sub>d</sub> NOTE2: 1.5 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.55 ; t<sub>L</sub> NOTE6: 0.55 µs; V<sub>R</sub> max: 60 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAP51-06W,115 | NXP Semiconductors | General purpose PIN diode; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAP63-02,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.25@VR=20V AND F=1MHz0.32@VR=1V and F=1MHz0.36@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 3.5 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 1.8 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.31 ; V<sub>R</sub> max: 50 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAP63-03,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.27@VR=5V AND F=1MHz0.35@VR=1V and F=1MHz0.4@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 3.5 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 1.8 Ohm; R<sub>d</sub> NOTE2: 2 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.31 ; V<sub>R</sub> max: 50 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAP64-02,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.35@VR=1V AND F=1MHz0.48@VR=0V AND F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 175 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 3.8 Ohm; R<sub>d</sub> NOTE1: 20 Ohm; R<sub>d</sub> NOTE2: 2 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.55 ; t<sub>L</sub> NOTE6: 1.55 µs; V<sub>R</sub> max: 200 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAP64-03,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.35@VR=1V AND F=1MHz0.48@VR=0V AND F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 175 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 3.8 Ohm; R<sub>d</sub> NOTE1: 20 Ohm; R<sub>d</sub> NOTE2: 2 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.55 ; t<sub>L</sub> NOTE6: 1.55 µs; V<sub>R</sub> max: 200 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAP64-04W,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.37@VR=1V AND F=1MHz0.52@VR=0V AND F=1MHz pF; Configuration: Series ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 3.8 Ohm; R<sub>d</sub> NOTE1: 40 Ohm; R<sub>d</sub> NOTE2: 3.8 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.55 ; t<sub>L</sub> NOTE6: 1.55 µs; V<sub>R</sub> max: 200 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAP64-05,215 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.37@VR=1V AND F=1MHz0.52@VR=0V AND F=1MHz pF; Configuration: Common cathode ; I<sub>F</sub> max: 175 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 3.8 Ohm; R<sub>d</sub> NOTE1: 20 Ohm; R<sub>d</sub> NOTE2: 2 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.55 ; t<sub>L</sub> NOTE6: 1.55 µs; V<sub>R</sub> max: 200 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAP64-05W,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.37@VR=1V AND F=1MHz0.52@VR=0V AND F=1MHz pF; Configuration: Common cathode ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 40 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 3.8 Ohm; R<sub>d</sub> NOTE2: 0.9 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.55 ; V<sub>R</sub> max: 200 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAP64Q,125 | NXP Semiconductors | BAP64Q - Quad PIN diode attenuator, SOT753 Package, Standard Marking, Reel Pack, Reverse |
| BAP65-02,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.23@VR=20V AND F=1MHz0.37@VR=1V and F=1MHz0.52@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 0.95@IF=5mA Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 0.9 Ohm; R<sub>d</sub> NOTE2: 0.9 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.17 ; t<sub>L</sub> NOTE6: 0.17 µs; V<sub>R</sub> max: 30 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAP65-03,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.375@VR=20V AND F=1MHz0.55@VR=1V and F=1MHz0.65@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 0.95@IF=5mA Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 0.9 Ohm; R<sub>d</sub> NOTE2: 0.9 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 0.17 ; t<sub>L</sub> NOTE6: 0.17 µs; V<sub>R</sub> max: 30 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAP70-02,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.25@VR=20V AND F=1MHz max0.40@VR=1V and F=1MHz0.57@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 1 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 7 Ohm; R<sub>d</sub> NOTE2: 7 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.25 ; V<sub>R</sub> max: 50 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAP70-03,115 | NXP Semiconductors | Silicon PIN diode - C<sub>d</sub> typ.: 0.25@VR=20V AND F=1MHz max0.40@VR=1V and F=1MHz0.57@VR=0V and F=1MHz pF; Configuration: Single ; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=0.5 mA AND F=100 MHz max: 1 Ohm; R<sub>D</sub> @ I<sub>F</sub>=10 mA AND F=100 MHz max: 7 Ohm; R<sub>d</sub> NOTE2: 7 Ohm; t<sub>L</sub> @I<sub>F</sub>=10 mA AND I<sub>R</sub>=6 mA: 1.25 ; V<sub>R</sub> max: 50 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAP70Q,125 | NXP Semiconductors | BAP70Q - Quad PIN diode attenuator, SOT753 Package, Standard Marking, Reel Pack, Reverse |
| BAS116,215 | NXP Semiconductors | Low-leakage diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 3000 ns; V<sub>F</sub>max: 1@IF=10mA mV; V<sub>R</sub> max: 75 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS116,235 | NXP Semiconductors | Low-leakage diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 3000 ns; V<sub>F</sub>max: 1@IF=10mA mV; V<sub>R</sub> max: 75 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS116H,115 | NXP Semiconductors | 75 V low leakage diode in small SOD123F package - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 3000 ns; V<sub>F</sub>max: 1@IF=10mA mV; V<sub>R</sub> max: 75 V; Package: SOD123F (SOD2); Container: Tape reel smd |
| BAS16 | NXP Semiconductors | BAS16 - High-speed diode - Cd max.: 1.5 pF; Configuration: single ; IF max: 215 mA; IFSM max: 4 A; IR max: 1000@VR=75V nA; IFRM: 500 mA; trr max: 4 ns; VFmax: 1@IF=50mA mV; VR max: 75 V |
| BAS16,235 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS16H,115 | NXP Semiconductors | High-speed switching diode in SOD123F package - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 100 V; Package: SOD123F (SOD2); Container: Tape reel smd |
| BAS16J,115 | NXP Semiconductors | Single high-speed switching diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 3.3 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 100 V; Package: SOD323F (SOD2); Container: Tape reel smd |
| BAS16J,135 | NXP Semiconductors | DIODE SW 75V 215MA HS SC-90 |
| BAS16L,315 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOD882 (SOD2); Container: Tape reel smd |
| BAS16LD,315 | NXP Semiconductors | BAS16LD - Single high-speed switching diode, SOD882D Package, Standard Marking, Reel Pack, SMD, Pitch 2mm |
| BAS16T,115 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 155 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOT416 (SC-75); Container: Tape reel smd |
| BAS16VV,115 | NXP Semiconductors | Triple high-speed switching diodes - C<sub>d</sub> max.: 1.5 pF; Configuration: triple isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 4.5 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 450 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 100 V; Package: SOT666 (SS-Mini); Container: Tape reel smd |
| BAS16VY,115 | NXP Semiconductors | Triple high-speed switching diodes - C<sub>d</sub> max.: 1.5 pF; Configuration: triple isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 4.5 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 450 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 100 V; Package: SOT363 (SC-88); Container: Tape reel smd |
| BAS16W,115 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 175 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS17,215 | NXP Semiconductors | Low-voltage stabistor - Configuration: single ; I<sub>F</sub> max: 200 mA; P<sub>tot</sub>: 250 mW; V<sub>Z</sub> nom: 5 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS20 | NXP Semiconductors | BAS20 - General purpose diodes - Cd max.: 5 pF; Configuration: single ; IF max: 200 mA; IFSM max: 9 A; IR max: 100@VR=150V nA; IFRM: 625 mA; trr max: 50 ns; VFmax: 1@IF=100mA mV; VR max: 150 V |
| BAS21 | NXP Semiconductors | BAS21 - General purpose diodes - Cd max.: 5 pF; Configuration: single ; IF max: 200 mA; IFSM max: 9 A; IR max: 100@VR=200V nA; IFRM: 625 mA; trr max: 50 ns; VFmax: 1@IF=100mA mV; VR max: 200 V |
| BAS21,215 | NXP Semiconductors | General purpose diodes - C<sub>d</sub> max.: 5 pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 9 A; I<sub>R</sub> max: 100@VR=200V nA; IFRM: 625 mA; t<sub>rr</sub> max: 50 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 200 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS21AVD,165 | NXP Semiconductors | BAS21 - DIODE 250 V, 3 ELEMENT, SILICON, SIGNAL DIODE, PLASTIC, SC-74, 6 PIN, Signal Diode |
| BAS21VD,135 | NXP Semiconductors | High-voltage switching diode array - C<sub>d</sub> max.: 5 pF; Configuration: triple isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 16 A; I<sub>R</sub> max: 100@VR=200V nA; IFRM: 1000 mA; t<sub>rr</sub> max: 50 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 200 V; Package: SOT457 (SC-74); Container: Tape reel smd |
| BAS28,215 | NXP Semiconductors | High-speed double diode - C<sub>d</sub> max.: 1.5 pF; Configuration: dual isolated ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAS28,235 | NXP Semiconductors | High-speed double diode - C<sub>d</sub> max.: 1.5 pF; Configuration: dual isolated ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAS29 | NXP Semiconductors | BAS29 - General purpose controlled avalanche (double) diodes - Cd max.: 35 pF; Configuration: single ; IF max: 250 mA; IFSM max: 10 A; IR max: 100@VR=90V nA; IFRM: 600 mA; trr max: 50 ns; VFmax: 1@IF=200mA mV; VR max: 90 V |
| BAS29,215 | NXP Semiconductors | General purpose controlled avalanche (double) diodes - C<sub>d</sub> max.: 35 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 10 A; I<sub>R</sub> max: 100@VR=90V nA; IFRM: 600 mA; t<sub>rr</sub> max: 50 ns; V<sub>F</sub>max: 1@IF=200mA mV; V<sub>R</sub> max: 90 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS31 | NXP Semiconductors | BAS31 - General purpose controlled avalanche (double) diodes - Cd max.: 35 pF; Configuration: dual series ; IF max: 250 mA; IFSM max: 10 A; IR max: 100@VR=90V nA; IFRM: 600 mA; trr max: 50 ns; VFmax: 1@IF=200mA mV; VR max: 90 V |
| BAS316,115 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 100 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAS316Z | NXP Semiconductors | BAS316 - BAS316 - High-speed switching diodes |
| BAS321,115 | NXP Semiconductors | General purpose diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 9 A; I<sub>R</sub> max: 100@VR=200V nA; IFRM: 625 mA; t<sub>rr</sub> max: 50 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 200 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAS32L,115 | NXP Semiconductors | High-speed switching diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5000@VR=75V nA; IFRM: 450 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 75 V; Package: SOD80C (LLDS; MiniMelf); Container: Tape reel smd |
| BAS32L,135 | NXP Semiconductors | High-speed switching diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5000@VR=75V nA; IFRM: 450 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 75 V; Package: SOD80C (LLDS; MiniMelf); Container: Tape reel smd |
| BAS35 | NXP Semiconductors | BAS35 - General purpose controlled avalanche (double) diodes - Cd max.: 35 pF; Configuration: dual c.a. ; IF max: 250 mA; IFSM max: 10 A; IR max: 100@VR=90V nA; IFRM: 600 mA; trr max: 50 ns; VFmax: 1@IF=200mA mV; VR max: 90 V |
| BAS35,215 | NXP Semiconductors | General purpose controlled avalanche (double) diodes - C<sub>d</sub> max.: 35 pF; Configuration: dual c.a. ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 10 A; I<sub>R</sub> max: 100@VR=90V nA; IFRM: 600 mA; t<sub>rr</sub> max: 50 ns; V<sub>F</sub>max: 1@IF=200mA mV; V<sub>R</sub> max: 90 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40,235 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40-04,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual series ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40-04,235 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual series ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40-04W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual series ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS40-05,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40-05V,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT666 (SS-Mini); Container: Tape reel smd |
| BAS40-05W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS40-06,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS40-06W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS40-07,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual isolated ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAS40-07V,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: dual isolated ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT666 (SS-Mini); Container: Tape reel smd |
| BAS40H,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOD123F (SOD2); Container: Tape reel smd |
| BAS40W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 5@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 120 mA; I<sub>FSM</sub> max: 200 A; I<sub>R</sub> max: 1@VR=30VA; V<sub>F</sub>max: 500@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS416,115 | NXP Semiconductors | Low-leakage diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 3000 ns; V<sub>F</sub>max: 1@IF=10mA mV; V<sub>R</sub> max: 75 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAS45A,113 | NXP Semiconductors | Low-leakage diode - C<sub>d</sub> max.: 4 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1@VR=125V nA; IFRM: 625 mA; t<sub>rr</sub> max: 1500 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 125 V; Package: SOD68 (DO-34); Container: Reel pack axial radial |
| BAS45AL,115 | NXP Semiconductors | Low-leakage diode - C<sub>d</sub> max.: 4 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1@VR=125V nA; IFRM: 625 mA; t<sub>rr</sub> max: 1500 ns; V<sub>F</sub>max: 1@IF=100mA mV; V<sub>R</sub> max: 125 V; Package: SOD80C (LLDS; MiniMelf); Container: Tape reel smd |
| BAS516,115 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAS516,135 | NXP Semiconductors | High-speed diode - C<sub>d</sub> max.: 1 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 75 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAS521,115 | NXP Semiconductors | High voltage switching diode - C<sub>d</sub> max.: 5 pF; Configuration: single ; I<sub>F</sub> max: 250 mA; I<sub>FSM</sub> max: 4.5 A; I<sub>R</sub> max: 150@VR=250V nA; IFRM: 1000 mA; t<sub>rr</sub> max: 50 ns; V<sub>F</sub>max: 1.1@IF=100mA mV; V<sub>R</sub> max: 300 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAS521,135 | NXP Semiconductors | BAS521 - DIODE 0.25 A, 300 V, SILICON, SIGNAL DIODE, ULTRA SMALL, PLASTIC, SC-79, 2 PIN, Signal Diode |
| BAS521,315 | NXP Semiconductors | BAS521 - DIODE 0.25 A, 300 V, SILICON, SIGNAL DIODE, ULTRA SMALL, PLASTIC, SC-79, 2 PIN, Signal Diode |
| BAS56,215 | NXP Semiconductors | High-speed double diode - C<sub>d</sub> max.: 2.5 pF; Configuration: dual isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 9 A; I<sub>R</sub> max: 100@VR=60V nA; IFRM: 600 mA; t<sub>rr</sub> max: 6 ns; V<sub>F</sub>max: 1@IF=200mA mV; V<sub>R</sub> max: 60 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAS56,235 | NXP Semiconductors | High-speed double diode - C<sub>d</sub> max.: 2.5 pF; Configuration: dual isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 9 A; I<sub>R</sub> max: 100@VR=60V nA; IFRM: 600 mA; t<sub>rr</sub> max: 6 ns; V<sub>F</sub>max: 1@IF=200mA mV; V<sub>R</sub> max: 60 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAS70,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS70,235 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS70-04,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual series ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS70-04W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual series ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS70-05,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS70-05W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS70-06,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAS70-06W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS70-07,215 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual isolated ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAS70-07S,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: dual isolated ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT363 (SC-88); Container: Tape reel smd |
| BAS70L,315 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOD882 (SOD2); Container: Tape reel smd |
| BAS70W,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAS70XY,115 | NXP Semiconductors | General-purpose Schottky diodes - C<sub>d</sub> max.: 2@VR=0V pF; Configuration: quad 2x series ; I<sub>F</sub> max: 70 mA; I<sub>FSM</sub> max: 100 A; I<sub>R</sub> max: 0.1@VR=50VA; V<sub>F</sub>max: 750@IF=10mA mV; V<sub>R</sub> max: 70 V; Package: SOT363 (SC-88); Container: Tape reel smd |
| BAS716,115 | NXP Semiconductors | Low-leakage diode - C<sub>d</sub> max.: 2 pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 5@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 3000 ns; V<sub>F</sub>max: 1@IF=10mA mV; V<sub>R</sub> max: 75 V; Package: SOD523 (SC-79); Container: Tape reel smd |
| BAS85,115 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 300 A; I<sub>R</sub> max: 2.3@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOD80C (LLDS; MiniMelf); Container: Tape reel smd |
| BAS85,135 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 300 A; I<sub>R</sub> max: 2.3@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOD80C (LLDS; MiniMelf); Container: Tape reel smd |
| BAS86,115 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 8@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 5000 A; I<sub>R</sub> max: 5@VR=40VA; V<sub>F</sub>max: 450@IF=10mA mV; V<sub>R</sub> max: 50 V; Package: SOD80C (LLDS; MiniMelf); Container: Tape reel smd |
| BAT120A,115 | NXP Semiconductors | Schottky barrier double diodes - C<sub>d</sub> max.: 100@VR=4V pF; Configuration: dual c.a. ; I<sub>F</sub>: 1 A; I<sub>FSM</sub> max: 10 A; I<sub>R</sub> max: 1@VR=25V mA; V<sub>F</sub>max: 450@IF=1A mV; V<sub>R</sub>: 25 V; Package: SOT223 (SC-73); Container: Tape reel smd |
| BAT120C,115 | NXP Semiconductors | Schottky barrier double diodes - C<sub>d</sub> max.: 100@VR=4V pF; Configuration: dual c.c. ; I<sub>F</sub>: 1 A; I<sub>FSM</sub> max: 10 A; I<sub>R</sub> max: 1@VR=25V mA; V<sub>F</sub>max: 450@IF=1A mV; V<sub>R</sub>: 25 V; Package: SOT223 (SC-73); Container: Tape reel smd |
| BAT120S,115 | NXP Semiconductors | Schottky barrier double diodes - C<sub>d</sub> max.: 100@VR=4V pF; Configuration: dual series ; I<sub>F</sub>: 1 A; I<sub>FSM</sub> max: 10 A; I<sub>R</sub> max: 1@VR=25V mA; V<sub>F</sub>max: 450@IF=1A mV; V<sub>R</sub>: 25 V; Package: SOT223 (SC-73); Container: Tape reel smd |
| BAT160S,115 | NXP Semiconductors | Schottky barrier double diodes - C<sub>d</sub> max.: 60@VR=4V pF; Configuration: dual series ; I<sub>F</sub>: 1 A; I<sub>FSM</sub> max: 10 A; I<sub>R</sub> max: 0.35@VR=60V mA; V<sub>F</sub>max: 650@IF=1A mV; V<sub>R</sub>: 60 V; Package: SOT223 (SC-73); Container: Tape reel smd |
| BAT17,215 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 1@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 30 mA; I<sub>FSM</sub> max: - A; I<sub>R</sub> max: 1.3@VR=3VA; I<sub>R</sub> max: 1.3@VR=3V mA; V<sub>F</sub>max: 450@IF=1mA mV; V<sub>R</sub> max: 4 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT17,235 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 1@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 30 mA; I<sub>FSM</sub> max: - A; I<sub>R</sub> max: 1.3@VR=3VA; I<sub>R</sub> max: 1.3@VR=3V mA; V<sub>F</sub>max: 450@IF=1mA mV; V<sub>R</sub> max: 4 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT18,215 | NXP Semiconductors | Silicon planar diode - C<sub>d</sub> max.: 1.0@VR=20V pF; I<sub>F</sub> max: 100 mA; R<sub>D</sub> @ I<sub>F</sub>=5 mA AND F=200 MHz max: 0.7 Ohm; R<sub>S</sub> max: 0.7 ; V<sub>R</sub> max: 35 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT46WH,115 | NXP Semiconductors | BAT46 - DIODE 0.25 A, 100 V, SILICON, SIGNAL DIODE, PLASTIC PACKAGE-2, Signal Diode |
| BAT46WJ,115 | NXP Semiconductors | BAT46 - DIODE 0.25 A, 100 V, SILICON, SIGNAL DIODE, PLASTIC, SC-90, 2 PIN, Signal Diode |
| BAT54 | NXP Semiconductors | BAT54 - Schottky barrier (double) diodes - Cd max.: 10@VR=1V pF; Configuration: single ; IF max: 200 mA; IFSM max: 600 A; IR max: 2@VR=25VA; VFmax: 400@IF=10mA mV; VR max: 30 V |
| BAT54,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT54,235 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT54A | NXP Semiconductors | BAT54A - Schottky barrier (double) diodes - Cd max.: 10@VR=1V pF; Configuration: dual c.a. ; IF max: 200 mA; IFSM max: 600 A; IR max: 2@VR=25VA; VFmax: 400@IF=10mA mV; VR max: 30 V |
| BAT54A,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT54AW,115 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAT54C | NXP Semiconductors | BAT54C - Schottky barrier (double) diodes - Cd max.: 10@VR=1V pF; Configuration: dual c.c. ; IF max: 200 mA; IFSM max: 600 A; IR max: 2@VR=25VA; VFmax: 400@IF=10mA mV; VR max: 30 V |
| BAT54C,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT54C,235 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT54CM,315 | NXP Semiconductors | Schottky barrier double diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT883 (SC-101); Container: Tape reel smd |
| BAT54CV,115 | NXP Semiconductors | Two Schottky barrier double diodes in ultra small SOT666 package - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: quad c.c./c.c. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT666 (SS-Mini); Container: Tape reel smd |
| BAT54CW,115 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAT54H,115 | NXP Semiconductors | Schottky barrier single diode in small SOD123F package - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOD123F (SOD2); Container: Tape reel smd |
| BAT54J,115 | NXP Semiconductors | Schottky barrier single diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOD323F (SOD2); Container: Tape reel smd |
| BAT54S | NXP Semiconductors | BAT54S - Schottky barrier (double) diodes - Cd max.: 10@VR=1V pF; Configuration: dual series ; IF max: 200 mA; IFSM max: 600 A; IR max: 2@VR=25VA; VFmax: 400@IF=10mA mV; VR max: 30 V |
| BAT54S,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual series ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT54SW,115 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual series ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAT54VV,115 | NXP Semiconductors | Schottky barrier triple diode in ultra small SOT666 package - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: triple isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT666 (SS-Mini); Container: Tape reel smd |
| BAT54W,115 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAT54W,135 | NXP Semiconductors | BAT54 - DIODE SIGNAL DIODE, Signal Diode |
| BAT54XY,115 | NXP Semiconductors | Schottky barrier quadruple diode in very small SOT363 package - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: quad 2x series ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT363 (SC-88); Container: Tape reel smd |
| BAT720,215 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 90@VR=0V pF; Configuration: single ; I<sub>F</sub>: 0.5 A; I<sub>FSM</sub> max: 2 A; I<sub>R</sub> max: 0.1@VR=35V mA; V<sub>F</sub>max: 550@IF=0.5A mV; V<sub>R</sub>: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT720,235 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 90@VR=0V pF; Configuration: single ; I<sub>F</sub>: 0.5 A; I<sub>FSM</sub> max: 2 A; I<sub>R</sub> max: 0.1@VR=35V mA; V<sub>F</sub>max: 550@IF=0.5A mV; V<sub>R</sub>: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT721,215 | NXP Semiconductors | Schottky barrier diodes in small packages - C<sub>d</sub> max.: 50@VR=0V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 1000 A; I<sub>R</sub> max: 15@VR=30VA; V<sub>F</sub>max: 300@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT721A,215 | NXP Semiconductors | Schottky barrier diodes in small packages - C<sub>d</sub> max.: 50@VR=0V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 1000 A; I<sub>R</sub> max: 15@VR=30VA; V<sub>F</sub>max: 300@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT721C,215 | NXP Semiconductors | Schottky barrier diodes in small packages - C<sub>d</sub> max.: 50@VR=0V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 1000 A; I<sub>R</sub> max: 15@VR=30VA; V<sub>F</sub>max: 300@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT721S,215 | NXP Semiconductors | Schottky barrier diodes in small packages - C<sub>d</sub> max.: 50@VR=0V pF; Configuration: dual series ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 1000 A; I<sub>R</sub> max: 15@VR=30VA; V<sub>F</sub>max: 300@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT74,215 | NXP Semiconductors | Schottky barrier double diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT143B (SOT4); Container: Tape reel smd |
| BAT74S,115 | NXP Semiconductors | Schottky barrier double diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT363 (SC-88); Container: Tape reel smd |
| BAT754,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 340@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT754A,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.a. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 340@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT754C,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual c.c. ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 340@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT754L,115 | NXP Semiconductors | Schottky barrier triple diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: triple isolated ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 340@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT363 (SC-88); Container: Tape reel smd |
| BAT754S,215 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: dual series ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 600 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 340@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| BAT760,115 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 25@VR=5V pF; Configuration: single ; I<sub>F</sub>: 1 A; I<sub>FSM</sub> max: 5 A; I<sub>R</sub> max: 0.05@VR=15V mA; V<sub>F</sub>max: 550@IF=1A mV; V<sub>R</sub>: 20 V; Package: SOD323 (UMD2; I-IEIA; URP); Container: Tape reel smd |
| BAT85,113 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 5000 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOD68 (DO-34); Container: Reel pack axial radial |
| BAT85,133 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 10@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 5000 A; I<sub>R</sub> max: 2@VR=25VA; V<sub>F</sub>max: 400@IF=10mA mV; V<sub>R</sub> max: 30 V; Package: SOD68 (DO-34); Container: Ammo pack axial radial taped |
| BAT854W,115 | NXP Semiconductors | Schottky barrier (double) diodes - C<sub>d</sub> max.: 20@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 1000 A; I<sub>R</sub> max: 0.5@VR=25VA; V<sub>F</sub>max: 420@IF=10mA mV; V<sub>R</sub> max: 40 V; Package: SOT323 (SC-70); Container: Tape reel smd |
| BAT86,113 | NXP Semiconductors | Schottky barrier diode - C<sub>d</sub> max.: 8@VR=1V pF; Configuration: single ; I<sub>F</sub> max: 200 mA; I<sub>FSM</sub> max: 5000 A; I<sub>R</sub> max: 5@VR=40VA; V<sub>F</sub>max: 450@IF=10mA mV; V<sub>R</sub> max: 50 V; Package: SOD68 (DO-34); Container: Reel pack axial radial |
Each PDF datasheet is copyright by its repective electronic component manufacturer: NXP Semiconductors