| HEF4047BP,652 | NXP Semiconductors | Monostable/astable multivibrator - Description: Monostable/Astable Multivibrator ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT27-1 (DIP14); Container: Bulk Pack, CECC |
| HEF4047BT,652 | NXP Semiconductors | Monostable/astable multivibrator - Description: Monostable/Astable Multivibrator ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Bulk Pack, CECC |
| HEF4047BT,653 | NXP Semiconductors | Monostable/astable multivibrator - Description: Monostable/Astable Multivibrator ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13", CECC |
| HEF4049BP,652 | NXP Semiconductors | HEX inverting buffers - Description: Buffer; Inverting ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -3/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4049BT,652 | NXP Semiconductors | HEX inverting buffers - Description: Buffer; Inverting ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -3/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4049BT,653 | NXP Semiconductors | HEX inverting buffers - Description: Buffer; Inverting ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -3/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4050BP,652 | NXP Semiconductors | HEX non-inverting buffers - Description: Buffer; Non-Inverting ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -3/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4050BT,652 | NXP Semiconductors | HEX non-inverting buffers - Description: Buffer; Non-Inverting ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -3/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4050BT,653 | NXP Semiconductors | HEX non-inverting buffers - Description: Buffer; Non-Inverting ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -3/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4051BP,652 | NXP Semiconductors | 8-channel analog multiplexer/demultiplexer - Description: 8-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4051BT,652 | NXP Semiconductors | 8-channel analog multiplexer/demultiplexer - Description: 8-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4051BT,653 | NXP Semiconductors | 8-channel analog multiplexer/demultiplexer - Description: 8-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4051BT-Q100,118 | NXP Semiconductors | HEF4051BT-Q100 - HEF4051BT-Q100 - 8-channel analog multiplexer/demultiplexer |
| HEF4051BTS,118 | NXP Semiconductors | HEF4051 - IC 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16, Multiplexer or Switch |
| HEF4051BTT,118 | NXP Semiconductors | 8-channel analog multiplexer/demultiplexer - Description: 8-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT403-1 (TSSOP16); Container: Reel Pack, SMD, 13" |
| HEF4052BT,652 | NXP Semiconductors | Dual 4-channel analogue multiplexer/demultiplexer - Description: Dual 4-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4052BT,653 | NXP Semiconductors | Dual 4-channel analogue multiplexer/demultiplexer - Description: Dual 4-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4052BT-Q100,118 | NXP Semiconductors | HEF4052BT-Q100 - HEF4052BT-Q100 - Dual 4-channel analog multiplexer/demultiplexer |
| HEF4052BTT,118 | NXP Semiconductors | IC IC,ANALOG MUX,SINGLE,4-CHANNEL,TSSOP,16PIN,PLASTIC, Multiplexer or Switch |
| HEF4053BP,652 | NXP Semiconductors | Triple 2-channel analogue multiplexer/demultiplexer - Description: Triple 2-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4053BT,652 | NXP Semiconductors | Triple 2-channel analogue multiplexer/demultiplexer - Description: Triple 2-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4053BT,653 | NXP Semiconductors | Triple 2-channel analogue multiplexer/demultiplexer - Description: Triple 2-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4053BTT,118 | NXP Semiconductors | Triple 2-channel analogue multiplexer/demultiplexer - Description: Triple 2-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: SOT403-1 (TSSOP16); Container: Reel Pack, SMD, 13" |
| HEF4059BT,652 | NXP Semiconductors | Programmable divide-by-n counter - Description: Programmable Divide-By-N Counter ; F<sub>max</sub>: 20 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 24 ; Output drive capability: -7/+20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT137-1 (SO24); Container: Bulk Pack, CECC |
| HEF4060BP,652 | NXP Semiconductors | 14-stage ripple-carry binary counter/divider and oscillator - Description: 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator ; F<sub>max</sub>: 30 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4060BT,652 | NXP Semiconductors | 14-stage ripple-carry binary counter/divider and oscillator - Description: 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator ; F<sub>max</sub>: 30 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: week 12, 2005 |
| HEF4060BT,653 | NXP Semiconductors | 14-stage ripple-carry binary counter/divider and oscillator - Description: 14-Stage Ripple-Carry Binary Counter/Divider and Oscillator ; F<sub>max</sub>: 30 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: week 12, 2005 |
| HEF4066BP,652 | NXP Semiconductors | Quadruple bilateral switches - Description: Quad Bilateral Switch; Low "ON" Resistance ; Logic switching levels: CMOS ; Number of pins: 14 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4066BT,652 | NXP Semiconductors | Quadruple bilateral switches - Description: Quad Bilateral Switch; Low "ON" Resistance ; Logic switching levels: CMOS ; Number of pins: 14 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: week 32, 2004 |
| HEF4066BT,653 | NXP Semiconductors | Quadruple bilateral switches - Description: Quad Bilateral Switch; Low "ON" Resistance ; Logic switching levels: CMOS ; Number of pins: 14 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: week 32, 2004 |
| HEF4067BP,652 | NXP Semiconductors | 16-channel analogue multiplexer/demultiplexer - Description: 16-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 24 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4067BT,652 | NXP Semiconductors | 16-channel analogue multiplexer/demultiplexer - Description: 16-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 24 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: week 13, 2005 |
| HEF4067BT,653 | NXP Semiconductors | 16-channel analogue multiplexer/demultiplexer - Description: 16-Channel Analog Multiplexer/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 24 ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 5@15V ns; Voltage: 4.5-15.5 V; Package: week 13, 2005 |
| HEF4069UBP,652 | NXP Semiconductors | Hex inverter - Description: Hex Inverter (Unbuffered) ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 15@15V ns; Voltage: 4.5-15.5 V; Package: SOT27-1 (DIP14); Container: Bulk Pack, CECC |
| HEF4069UBT,652 | NXP Semiconductors | Hex inverter - Description: Hex Inverter (Unbuffered) ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 15@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Bulk Pack, CECC |
| HEF4069UBT,653 | NXP Semiconductors | Hex inverter - Description: Hex Inverter (Unbuffered) ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 15@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13", CECC |
| HEF4069UBT-Q100J | NXP Semiconductors | HEF4069UBT-Q100 - HEF4069UBT-Q100 - Hex inverter |
| HEF4069UBTT,118 | NXP Semiconductors | Hex inverter; Package: SOT402-1 (TSSOP14); Container: Reel Pack, SMD, 13" |
| HEF4070BP,652 | NXP Semiconductors | Quadruple exclusive-OR gate - Description: Quad EXCLUSIVE-OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4070BT,652 | NXP Semiconductors | Quadruple exclusive-OR gate - Description: Quad EXCLUSIVE-OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4070BT,653 | NXP Semiconductors | Quadruple exclusive-OR gate - Description: Quad EXCLUSIVE-OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4071BP,652 | NXP Semiconductors | Quadruple 2-input OR gate - Description: Quad 2-Input OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: SOT27-1 (DIP14); Container: Bulk Pack, CECC |
| HEF4071BT,652 | NXP Semiconductors | Quadruple 2-input OR gate - Description: Quad 2-Input OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Bulk Pack, CECC |
| HEF4071BT,653 | NXP Semiconductors | Quadruple 2-input OR gate - Description: Quad 2-Input OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13", CECC |
| HEF4072BT,652 | NXP Semiconductors | Dual 4-input OR gate - Description: Dual 4-Input OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 25@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4072BT,653 | NXP Semiconductors | Dual 4-input OR gate - Description: Dual 4-Input OR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 25@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4073BP,652 | NXP Semiconductors | Triple 3-input AND gate - Description: Triple 3-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4073BT,653 | NXP Semiconductors | Triple 3-input AND gate - Description: Triple 3-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4077BP,652 | NXP Semiconductors | Quadruple EXCLUSIVE-NOR gate - Description: Quad EXCLUSIVE-NOR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4077BT,652 | NXP Semiconductors | Quadruple EXCLUSIVE-NOR gate - Description: Quad EXCLUSIVE-NOR Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4081BP,652 | NXP Semiconductors | Quad 2-input AND gate - Description: Quad 2-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: SOT27-1 (DIP14); Container: Bulk Pack, CECC |
| HEF4081BT,652 | NXP Semiconductors | Quad 2-input AND gate - Description: Quad 2-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Bulk Pack, CECC |
| HEF4081BT,653 | NXP Semiconductors | Quad 2-input AND gate - Description: Quad 2-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 20@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13", CECC |
| HEF4082BP,652 | NXP Semiconductors | Dual 4-input AND gate - Description: Dual 4-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 25@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4082BT,653 | NXP Semiconductors | Dual 4-input AND gate - Description: Dual 4-Input AND Gate ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 25@15V ns; Voltage: 4.5-15.5 V; Package: week 5, 2004 |
| HEF4093BP,652 | NXP Semiconductors | Quadruple 2-input NAND Schmitt trigger - Description: Quad 2-Input NAND Schmitt-Trigger ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: SOT27-1 (DIP14); Container: Bulk Pack, CECC |
| HEF4093BT,652 | NXP Semiconductors | Quadruple 2-input NAND Schmitt trigger - Description: Quad 2-Input NAND Schmitt-Trigger ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Bulk Pack, CECC |
| HEF4093BT,653 | NXP Semiconductors | Quadruple 2-input NAND Schmitt trigger - Description: Quad 2-Input NAND Schmitt-Trigger ; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 30@15V ns; Voltage: 4.5-15.5 V; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13", CECC |
| HEF4093BT-Q100,118 | NXP Semiconductors | HEF4093BT-Q100 - HEF4093BT-Q100 - Quad 2-input NAND Schmitt trigger |
| HEF4094BP,652 | NXP Semiconductors | 8-stage shift-and-store bus register - Description: 8-Stage Shift-and-Store Bus Register ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4094BT,652 | NXP Semiconductors | 8-stage shift-and-store bus register - Description: 8-Stage Shift-and-Store Bus Register ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4094BT,653 | NXP Semiconductors | 8-stage shift-and-store bus register - Description: 8-Stage Shift-and-Store Bus Register ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4094BTS,118 | NXP Semiconductors | 8-stage shift-and-store bus register - Description: 8-Stage Shift-and-Store Bus Register ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 50@15V ns; Voltage: 4.5-15.5 V; Package: SOT338-1 (SSOP16); Container: Reel Pack, SMD, 13" |
| HEF4104BP,652 | NXP Semiconductors | Quadruple low-to-high voltage translator with 3-state outputs - Description: Quad Low-to-High Voltage Translator with 3-State Outputs ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 70@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4104BT,652 | NXP Semiconductors | Quadruple low-to-high voltage translator with 3-state outputs - Description: Quad Low-to-High Voltage Translator with 3-State Outputs ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 70@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4104BT,653 | NXP Semiconductors | Quadruple low-to-high voltage translator with 3-state outputs - Description: Quad Low-to-High Voltage Translator with 3-State Outputs ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 70@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4511BP,652 | NXP Semiconductors | BCD to 7-segment latch/decoder/driver - Description: BCD to 7-Segment Latch/Decoder/Driver with Lamp Test Input ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -25/+2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4511BT,652 | NXP Semiconductors | BCD to 7-segment latch/decoder/driver - Description: BCD to 7-Segment Latch/Decoder/Driver with Lamp Test Input ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -25/+2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4511BT,653 | NXP Semiconductors | BCD to 7-segment latch/decoder/driver - Description: BCD to 7-Segment Latch/Decoder/Driver with Lamp Test Input ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -25/+2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4514BP,652 | NXP Semiconductors | 1-of-16 decoder/demultiplexer with input latches - Description: 1-of-16 Decoder/Demultiplexer with Input Latches; Outputs LOW at Data Input HIGH ; Logic switching levels: CMOS ; Number of pins: 24 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 65@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4514BT,652 | NXP Semiconductors | 1-of-16 decoder/demultiplexer with input latches - Description: 1-of-16 Decoder/Demultiplexer with Input Latches; Outputs LOW at Data Input HIGH ; Logic switching levels: CMOS ; Number of pins: 24 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 65@15V ns; Voltage: 4.5-15.5 V; Package: week 13, 2005 |
| HEF4516BP,652 | NXP Semiconductors | Binary up/down counter - Description: Binary Up/Down Counter ; F<sub>max</sub>: 18 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4516BT,652 | NXP Semiconductors | Binary up/down counter - Description: Binary Up/Down Counter ; F<sub>max</sub>: 18 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4517BP,652 | NXP Semiconductors | Dual 64-bit static shift register - Description: Dual 64-Bit Static Shift Register ; F<sub>max</sub>: 16 MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 60@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4520BP,652 | NXP Semiconductors | Dual binary counter - Description: Dual 4-Bit Synchronous Binary Counter ; F<sub>max</sub>: 40 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 15 ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4520BT,652 | NXP Semiconductors | Dual binary counter - Description: Dual 4-Bit Synchronous Binary Counter ; F<sub>max</sub>: 40 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 15 ns; Voltage: 4.5-15.5 V; Package: week 6, 2004 |
| HEF4520BT,653 | NXP Semiconductors | Dual binary counter - Description: Dual 4-Bit Synchronous Binary Counter ; F<sub>max</sub>: 40 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 15 ns; Voltage: 4.5-15.5 V; Package: week 6, 2004 |
| HEF4521BP,652 | NXP Semiconductors | 24-stage frequency divider and oscillator - Description: 24-Stage Frequency Divider and Oscillator ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 220@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4521BT,652 | NXP Semiconductors | 24-stage frequency divider and oscillator - Description: 24-Stage Frequency Divider and Oscillator ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 220@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4528BP,652 | NXP Semiconductors | Dual monostable multivibrator - Description: Dual Retriggerable Monostable Multivibrator with Reset ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4528BT,652 | NXP Semiconductors | Dual monostable multivibrator - Description: Dual Retriggerable Monostable Multivibrator with Reset ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4528BT,653 | NXP Semiconductors | Dual monostable multivibrator - Description: Dual Retriggerable Monostable Multivibrator with Reset ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4538BP,652 | NXP Semiconductors | Dual precision monostable multivibrator - Description: Dual Retriggerable Precision Monostable Multivibrator ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 60@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4538BT,652 | NXP Semiconductors | Dual precision monostable multivibrator - Description: Dual Retriggerable Precision Monostable Multivibrator ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 60@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4538BT,653 | NXP Semiconductors | Dual precision monostable multivibrator - Description: Dual Retriggerable Precision Monostable Multivibrator ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 60@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4538BT-Q100J | NXP Semiconductors | HEF4538BT-Q100 - HEF4538BT-Q100 - Dual precision monostable multivibrator |
| HEF4541BP,652 | NXP Semiconductors | Programmable timer - Description: Programmable Timer ; F<sub>max</sub>: 36 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: -4/+2.7 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 150@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4541BT,512 | NXP Semiconductors | Programmable timer - Description: Programmable Timer ; F<sub>max</sub>: 36 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: -4/+2.7 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 150@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4541BT,518 | NXP Semiconductors | Programmable timer - Description: Programmable Timer ; F<sub>max</sub>: 36 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 14 ; Output drive capability: -4/+2.7 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 150@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4541BT-Q100Y | NXP Semiconductors | HEF4541BT-Q100 - HEF4541BT-Q100 - Programmable timer |
| HEF4543BP,652 | NXP Semiconductors | BCD to 7-segment latch/decoder/driver - Description: BCD to 7-Segment Latch/Decoder/Driver with Phase Input ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 55@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Bulk Pack, CECC |
| HEF4543BT,652 | NXP Semiconductors | BCD to 7-segment latch/decoder/driver - Description: BCD to 7-Segment Latch/Decoder/Driver with Phase Input ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 55@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Bulk Pack, CECC |
| HEF4543BT,653 | NXP Semiconductors | BCD to 7-segment latch/decoder/driver - Description: BCD to 7-Segment Latch/Decoder/Driver with Phase Input ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 55@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13", CECC |
| HEF4555BP,652 | NXP Semiconductors | Dual 1-of-4 decoder/demultiplexer - Description: Dual 1-to-4 Line Decoder/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: Always Pb-free |
| HEF4555BT,652 | NXP Semiconductors | Dual 1-of-4 decoder/demultiplexer - Description: Dual 1-to-4 Line Decoder/Demultiplexer ; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: +/- 2.4 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 40@15V ns; Voltage: 4.5-15.5 V; Package: week 6, 2004 |
| HEF4794BP,112 | NXP Semiconductors | 8-stage shift-and-store register LED driver - Description: 8-Stage Shift-and-Store Register LED Driver ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -20 mA ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT38-4 (DIP16); Container: Tube |
| HEF4794BT,112 | NXP Semiconductors | 8-stage shift-and-store register LED driver - Description: 8-Stage Shift-and-Store Register LED Driver ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -20 mA ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Tube |
| HEF4794BT,118 | NXP Semiconductors | 8-stage shift-and-store register LED driver - Description: 8-Stage Shift-and-Store Register LED Driver ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -20 mA ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT109-1 (SO16); Container: Reel Pack, SMD, 13" |
| HEF4794BT-Q100J | NXP Semiconductors | HEF4794BT-Q100 - HEF4794BT-Q100 - 8-stage shift-and-store register LED driver |
| HEF4894BP,112 | NXP Semiconductors | 12-stage shift-and-store register, LED driver - Description: 12-Stage Shift-and-Store Register LED Driver ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 20 ; Output drive capability: 20 mA @ 15 V ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT146-1 (DIP20); Container: Tube |
| HEF4894BT,112 | NXP Semiconductors | 12-stage shift-and-store register, LED driver - Description: 8-Stage Shift-and-Store Register LED Driver ; F<sub>max</sub>: 28 @ 15 V MHz; Logic switching levels: CMOS ; Number of pins: 16 ; Output drive capability: -20 mA ; Power dissipation considerations: Low Power or Automotive Applications ; Propagation delay: 45@15V ns; Voltage: 4.5-15.5 V; Package: SOT163-1 (SO20); Container: Tube |
| HEF4894BT-Q100,118 | NXP Semiconductors | HEF4894BT-Q100 - HEF4894BT-Q100 - 12-stage shift-and-store register LED driver |
| HTRC11001T/02EE,11 | NXP Semiconductors | HITAG reader chip; Package: SOT108-1 (SO14); Container: Tube |
| HTRC11001T/03EE,11 | NXP Semiconductors | HITAG reader chip; Package: SOT108-1 (SO14); Container: Reel Pack, SMD, 13" |
| ICM7555CD/01,112 | NXP Semiconductors | General purpose CMOS timer; Package: SOT96-1 (SO8); Container: Tube |
| ICM7555ID/01,112 | NXP Semiconductors | General purpose CMOS timer; Package: SOT96-1 (SO8); Container: Tube |
| ICM7555ID/01,118 | NXP Semiconductors | General purpose CMOS timer; Package: SOT96-1 (SO8); Container: Tape reel smd |
| IP3319CX6,135 | NXP Semiconductors | IP3319CX6 - IP3319CX6 - Single-channel common-mode filter with integrated ESD protection network |
| IP4220CZ6,125 | NXP Semiconductors | Dual USB 2.0 integrated ESD protection to IEC 61000-4-2 level 4; Package: SOT457 (SC-74); Container: Tape reel smd, Reverse |
| IP4221CZ6-S,115 | NXP Semiconductors | Dual USB 2.0 integrated quad with ESD protection to IEC 61000-4-2, level 4 (Pb-free); Package: SOT886 (XSON6); Container: Tape reel smd |
| IP4233CZ6,125 | NXP Semiconductors | DIODE TRANSIENT SUPPRESSOR DIODE ARRAY,BIDIRECTIONAL,SOT-363, Transient Suppressor |
| IP4234CZ6,115 | NXP Semiconductors | IP4234CZ6 - Single USB 2.0 ESD protection to IEC 61000-4-2 level 4, SOT457 Package, Standard Marking, Reel Pack, SMD |
| IP4234CZ6,125 | NXP Semiconductors | IC USB2.0 ESD PROTECTION SOT457 |
| IP4238CZ10,115 | NXP Semiconductors | IP4238CZ10 - IP4238CZ10 - Surge protection for ethernet and telecom |
| IP4251CZ16-8-TTL,1 | NXP Semiconductors | IP4251CZ16-8-TTL - Integrated 4-, 6- and 8-channel passive filter network with ESD protection, SOT974-2 Package |
| IP4252CZ16-8-TTL,1 | NXP Semiconductors | IP4252CZ16-8-TTL - Integrated 4-, 6- and 8-channel passive filter network with ESD protection, SOT1168-1 Package |
| IP4252CZ8-4-TTL,13 | NXP Semiconductors | IP4252CZ8-4-TTL - Integrated 4-, 6- and 8-channel passive filter network with ESD protection, SOT972-2 Package |
| IP4254CZ12-6,118 | NXP Semiconductors | Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4, SOT984-1 (HXSON12U), Reel Pack, SMD, 13" |
| IP4254CZ16-8,118 | NXP Semiconductors | Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4, SOT985-1 (HXSON16U), Reel Pack, SMD, 13" |
| IP4254CZ8-4-TTL,13 | NXP Semiconductors | IP4254CZ8-4-TTL - Integrated 4-, 6- and 8-channel passive filter network with ESD protection, SOT1166-1 Package |
| IP4256CZ5-W,115 | NXP Semiconductors | IC EMI FILTER ESD 2CH SOT665 |
| IP4283CZ10-TBA,115 | NXP Semiconductors | DIODE TRANSIENT SUPPRESSOR DIODE ARRAY,UNIDIRECTIONAL,LLCC, Transient Suppressor |
| IP4283CZ10-TBR | NXP Semiconductors | ESD protection for ultra high-speed interfaces |
| IP4283CZ10-TBR,115 | NXP Semiconductors | DIODE TRANSIENT SUPPRESSOR DIODE ARRAY,UNIDIRECTIONAL,LLCC, Transient Suppressor |
| IP4283CZ10-TT,118 | NXP Semiconductors | ESD protection for ultra high-speed interfaces, SOT552-1 (TSSOP10), Reel Pack, SMD, 13" |
| IP4292CZ10-TBR,115 | NXP Semiconductors | TVS - Diodes, Circuit Protection, TVS DIODE 5.5VWM 4VC 10DFN |
| IP4294CZ10-TBR,115 | NXP Semiconductors | IP4294CZ10-TBR - ESD protection for ultra high-speed interfaces, SOT1176-1 Package, Standard Marking, Reel Pack, SMD, 7" |
| IP4369CX4YL | NXP Semiconductors | IP4369CX4 - IP4369CX4 - ESD protection for high-speed interfaces |
| IP4770CZ16,118 | NXP Semiconductors | VGA/video interface with integrated buffers, ESD protection and integrated termination resistors; Package: SOT519-1 (SSOP16); Container: Reel Pack, SMD, 13" |
| IP4772CZ16,118 | NXP Semiconductors | VGA/video interface with integrated buffers, ESD protection and integrated termination resistors; Package: SOT519-1 (SSOP16); Container: Reel Pack, SMD, 13" |
| IP4776CZ38,118 | NXP Semiconductors | Fully integrated HDMI interface with level shifter, ESD and backdrive protection; Package: SOT510-1 (TSSOP38); Container: Reel Pack, SMD, 13" |
| JN5168-001-M00Z | NXP Semiconductors | JN5168-001-M00 - JN5168-001-M00 - JenNet-IP, ZigBee PRO and IEEE802.15.4 Module |
| JN5168-001-M03Z | NXP Semiconductors | JN5168-001-M03 - JN5168-001-M03 - JenNet-IP, ZigBee PRO and IEEE802.15.4 Module |
| JN5168-001-M05Z | NXP Semiconductors | JN5168-001-M05 - JN5168-001-M05 - JenNet-IP, ZigBee PRO and IEEE802.15.4 Module |
| JN5168/001,515 | NXP Semiconductors | JN5168 - JN5168 - ZigBee, RF4CE, JenNet-IP and IEEE802.15.4 wireless microcontroller with 256 kB Flash, 32 kB RAM |
| KMA210:115 | NXP Semiconductors | KMA210 - Programmable angle sensor, Package, Standard Marking, Reel Pack, SMD, 7" |
| KMZ49,118 | NXP Semiconductors | KMZ49 - Magnetic field sensor, SOT96-1 Package, Standard Marking, Reel Pack, SMD, 13" |
| KMZ60,115 | NXP Semiconductors | KMZ60 - Angle sensor with integrated amplifier, SOT96-1 Package, Standard Marking, Reel Pack, SMD, 7" |
| KTY81/121,112 | NXP Semiconductors | Silicon temperature sensors; Package: SOD70 (PBCYT2); Container: Bulk pack |
| KTY81/220,112 | NXP Semiconductors | Silicon temperature sensors; Package: SOD70 (PBCYT2); Container: Bulk pack |
| KTY82/120,215 | NXP Semiconductors | Silicon temperature sensors; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| KTY82/210,215 | NXP Semiconductors | Silicon temperature sensors; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| KTY82/222,215 | NXP Semiconductors | Silicon temperature sensors; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| KTY83/110,113 | NXP Semiconductors | Silicon temperature sensors; Package: SOD68 (DO-34); Container: Reel pack axial radial |
| LD6806F/18H,115 | NXP Semiconductors | LD6806F/18H - Ultra low-dropout regulator, low noise, 200 mA, SOT886 Package, Standard Marking, Reel Pack, SMD |
| LD6806F/23H,115 | NXP Semiconductors | LD6806F/23H - Ultra low-dropout regulator, low noise, 200 mA, SOT886 Package, Standard Marking, Reel Pack, SMD |
| LD6806F/25H,115 | NXP Semiconductors | LD6806F/25H - Ultra low-dropout regulator, low noise, 200 mA, SOT886 Package, Standard Marking, Reel Pack, SMD |
| LD6806TD/33P,125 | NXP Semiconductors | LD6806TD/33P - Ultra low-dropout regulator, low noise, 200 mA, SOT753 Package, Standard Marking, Reel Pack, Reverse |
| LH75401N0Q100C0,55 | NXP Semiconductors | System-on-Chip; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LM258D | NXP Semiconductors | Low power dual operational amplifiers |
| LM258N | NXP Semiconductors | Low power dual operational amplifiers |
| LM2904N | NXP Semiconductors | Low power dual operational amplifiers |
| LM358AN | NXP Semiconductors | Low power dual operational amplifiers |
| LM358D | NXP Semiconductors | Low power dual operational amplifiers |
| LM75AD,112 | NXP Semiconductors | Digital temperature sensor and thermal watchdog - Accuracy on-chip: 2@-25~1002@+60~100C; Assignable addresses: 8 ; I2C-bus controlled: yes ; Internal temperature monitor: yes ; Operating temperature: -55~125 Cel; Operating voltage: 2.8~5.5 VDC; Over temperature alert: yes ; Part type: Supervisor, Temperature ; Remarks: Extended temperature range, temperature to digital converter, programmable threshold ; Remote temperature monitor: no ; SMBus clock: 400.0 kHz; Standby current: .0035 uA; Under temperature alert: no; Package: SOT96-1 (SO8); Container: Tube |
| LM75AD,118 | NXP Semiconductors | Digital temperature sensor and thermal watchdog - Accuracy on-chip: 2@-25~1002@+60~100C; Assignable addresses: 8 ; I2C-bus controlled: yes ; Internal temperature monitor: yes ; Operating temperature: -55~125 Cel; Operating voltage: 2.8~5.5 VDC; Over temperature alert: yes ; Part type: Supervisor, Temperature ; Remarks: Extended temperature range, temperature to digital converter, programmable threshold ; Remote temperature monitor: no ; SMBus clock: 400.0 kHz; Standby current: .0035 uA; Under temperature alert: no; Package: SOT96-1 (SO8); Container: Tape reel smd |
| LM75ADP,118 | NXP Semiconductors | Digital temperature sensor and thermal watchdog - Accuracy on-chip: 2@-25~1002@+60~100C; Assignable addresses: 8 ; Operating temperature: -55~125 Cel; Operating voltage: 2.8~5.5 VDC; Over temperature alert: yes ; Remote temperature monitor: no ; SMBus clock: 400.0 kHz; Standby current: .0035 uA; Under temperature alert: no; Package: SOT505-1 (TSSOP8); Container: Reel Pack, SMD, 13" |
| LM75BD,112 | NXP Semiconductors | LM75 - Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SERIAL, 11BIT(s), 3Cel, RECTANGULAR, SURFACE MOUNT, 3.9MM, PLASTIC, SOP -8 |
| LM75BD,118 | NXP Semiconductors | Digital temperature sensor and thermal watchdog, SOT96-1 (SO8), Tape reel SMD |
| LM75BDP,118 | NXP Semiconductors | Digital temperature sensor and thermal watchdog, SOT505-1 (TSSOP8), Reel Pack, SMD, 13" |
| LM75BDP/DG,118 | NXP Semiconductors | LM75BDP/DG - Digital temperature sensor and thermal watchdog, SOT505-1 Package, Standard Marking, Reel Pack, SMD, 13" |
| LM75BTP,147 | NXP Semiconductors | LM75 - Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SERIAL |
| LPC1102UK,118 | NXP Semiconductors | LPC1102UK - Cortex-M0, 32 kB flash, 8 kB SRAM, 2 x 2 mm WLCSP16 package, OL-LPC1102UK Package, Standard Marking, Reel Pack, SMD |
| LPC1111FHN33/101,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32VQFN |
| LPC1111FHN33/103,5 | NXP Semiconductors | LPC1111FHN33/103 - Cortex-M0, 8 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1111FHN33/201,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32VQFN |
| LPC1111FHN33/202,5 | NXP Semiconductors | IC MCU LV 32BIT 8K FLASH 32VQFN |
| LPC1111FHN33/203,5 | NXP Semiconductors | LPC1111FHN33/203 - Cortex-M0, 8 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1112FHN33/101,5 | NXP Semiconductors | LPC1112FHN33/101 - Cortex-M0, 16 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1112FHN33/102,5 | NXP Semiconductors | LPC1112FHN33/102 - Cortex-M0, 16 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1112FHN33/103,5 | NXP Semiconductors | LPC1112FHN33/103 - Cortex-M0, 16 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1112FHN33/201,5 | NXP Semiconductors | LPC1112FHN33/201 - Cortex-M0, 16 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1112FHN33/202,5 | NXP Semiconductors | LPC1112FHN33/202 - Cortex-M0, 16 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1112FHN33/203,5 | NXP Semiconductors | LPC1112FHN33/203 - Cortex-M0, 16 kB flash, up to 4 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1113FBD48/301,1 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 48LQFP |
| LPC1113FBD48/302,1 | NXP Semiconductors | IC MCU LV 32BIT 24K FLASH 48LQFP |
| LPC1113FBD48/303,1 | NXP Semiconductors | LPC1113FBD48/303 - Cortex-M0, 24 kB flash, 8 kB SRAM, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1113FHN33/201,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32VQFN |
| LPC1113FHN33/202,5 | NXP Semiconductors | IC MCU LV 32BIT 24K FLAS 32VQFN |
| LPC1113FHN33/203,5 | NXP Semiconductors | LPC1113FHN33/203 - Cortex-M0, 24 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1113FHN33/301,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32VQFN |
| LPC1113FHN33/302,5 | NXP Semiconductors | IC MCU LV 32BIT 24K FLAS 32VQFN |
| LPC1113FHN33/303,5 | NXP Semiconductors | LPC1113FHN33/303 - Cortex-M0, 24 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FBD48/301,1 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 48LQFP |
| LPC1114FBD48/302,1 | NXP Semiconductors | IC MCU LV 32BIT 32K FLASH 48LQFP |
| LPC1114FBD48/303,1 | NXP Semiconductors | LPC1114FBD48/303 - Cortex-M0, 32 kB flash, 8 kB SRAM, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1114FBD48/323,1 | NXP Semiconductors | LPC1114FBD48/323 - Cortex-M0, 32 kB flash, 8 kB SRAM, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1114FBD48/333,1 | NXP Semiconductors | LPC1114FBD48/333 - Cortex-M0, 32 kB flash, 8 kB SRAM, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1114FDH28/102:5 | NXP Semiconductors | LPC1114FDH28/102 - 32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 4 kB SRAM, SOT361-1 Package, Standard Markigg, Reel Dry Pack, SMD, 13" |
| LPC1114FHN33/201,5 | NXP Semiconductors | LPC1114FHN33/201 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FHN33/202,5 | NXP Semiconductors | LPC1114FHN33/202 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FHN33/203,5 | NXP Semiconductors | LPC1114FHN33/203 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FHN33/301,5 | NXP Semiconductors | LPC1114FHN33/301 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FHN33/302:5 | NXP Semiconductors | LPC1114FHN33/302 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FHN33/303,5 | NXP Semiconductors | LPC1114FHN33/303 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FHN33/333,5 | NXP Semiconductors | LPC1114FHN33/333 - Cortex-M0, 32 kB flash, up to 8 kB SRAM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1114FN28/102,12 | NXP Semiconductors | LPC1114FN28/102 - 32-bit ARM Cortex-M0 microcontroller; 32 kB flash and 4 kB SRAM, SOT117-1 Package, Standard Marking, Tube Small |
| LPC1115FBD48/303,1 | NXP Semiconductors | LPC1115FBD48/303 - Cortex-M0, 64 kB flash, 8 kB SRAM, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1115JBD48/303QL | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), MCU 32BIT 64KB FLASH 48LQFP |
| LPC11C12FBD48/301, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 16KB FLASH 48LQFP |
| LPC11C14FBD48/301 | NXP Semiconductors | NXP 50-MHz, 32-bit Cortex-M0 MCUs LPC11C00 |
| LPC11C14FBD48/301, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 32KB FLASH 48LQFP |
| LPC11C22FBD48/301, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 16KB FLASH 48LQFP |
| LPC11C24FBD48/301, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 32KB FLASH 48LQFP |
| LPC11E14FBD48/401, | NXP Semiconductors | LPC11E14FBD48/401 - 32-bit ARM Cortex-M0 microcontroller; 32 kB flash; 10 kB SRAM and 4 kB EEPROM; USART, SOT313-2 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC11E67JBD48E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), MCU ARM 32BIT 128K FLASH 48LQFP |
| LPC11E68JBD100E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), MCU ARM 32BIT 256K FLASH 100LQFP |
| LPC11U14FBD48/201, | NXP Semiconductors | LPC11U14FBD48/201 - 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; 6 kB SRAM; USB device; USART; 2 SSPs, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC11U24FBD48/401 | NXP Semiconductors | 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; up to 10 kB SRAM and 4 kB EEPROM; USB device; USART |
| LPC11U24FBD48/401, | NXP Semiconductors | LPC11U24FBD48/401 - 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; up to 10 kB SRAM and 4 kB EEPROM; USB device; USART, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC11U24FBD64/401 | NXP Semiconductors | 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; up to 10 kB SRAM and 4 kB EEPROM; USB device; USART |
| LPC11U24FET48/301, | NXP Semiconductors | LPC11U24FET48/301 - 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; up to 8 kB SRAM and 2 kB EEPROM; USB device; USART, SOT1155-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC11U24FHI33/301, | NXP Semiconductors | LPC11U24FHI33/301 - 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; up to 8 kB SRAM and 2 kB EEPROM; USB device; USART, SOT617-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC11U34FBD48/311, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 40KB FLASH 48LQFP |
| LPC11U35FET48/501, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 64KB FLASH 48TFBGA |
| LPC11U35FHI33/501, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 64KB FLASH 33HVQFN |
| LPC11U35FHN33/401, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 64KB FLASH 32HVQFN |
| LPC11U36FBD64/401, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 96KB FLASH 64LQFP |
| LPC11U37FBD48/401, | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU ARM 128KB FLASH 48LQFP |
| LPC11U67JBD48E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU CORTEX 48LQFP |
| LPC11U68JBD100E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU CORTEX 100LQFP |
| LPC11U68JBD48E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), MCU 32BIT 256KB FLASH 48LQFP |
| LPC1224FBD48/121,1 | NXP Semiconductors | LPC1224FBD48/121 - Cortex-M0 with up to 48 kB flash, 4 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1224FBD64/101,1 | NXP Semiconductors | LPC1224FBD64/101 - Cortex-M0 with up to 48 kB flash, 4 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT314-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1224FBD64/121,1 | NXP Semiconductors | LPC1224FBD64/121 - Cortex-M0 with up to 48 kB flash, 4 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT314-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1225FBD48/301,1 | NXP Semiconductors | LPC1225FBD48/301 - Cortex-M0 with up to 80 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1225FBD48/321,1 | NXP Semiconductors | LPC1225FBD48/321 - Cortex-M0 with up to 80 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1225FBD64/301,1 | NXP Semiconductors | LPC1225FBD64/301 - Cortex-M0 with up to 80 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT314-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1225FBD64/321,1 | NXP Semiconductors | LPC1225FBD64/321 - Cortex-M0 with up to 80 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT314-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1226FBD48/301,1 | NXP Semiconductors | LPC1226FBD48/301 - Cortex-M0 with 96 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1226FBD64/301,1 | NXP Semiconductors | LPC1226FBD64/301 - Cortex-M0 with 96 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT314-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1227FBD48/301,1 | NXP Semiconductors | LPC1227FBD48/301 - Cortex-M0 with 128 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1227FBD64/301,1 | NXP Semiconductors | LPC1227FBD64/301 - Cortex-M0 with 128 kB flash, 8 kB SRAM, RTC, comparator, 10-bit ADC, CRC, DMA and more, SOT314-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1311FHN33,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,ARM7 CPU,LLCC,32PIN,PLASTIC, Microcontroller |
| LPC1311FHN33/01,55 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,LLCC,32PIN,PLASTIC, Microcontroller |
| LPC1313FBD48,151 | NXP Semiconductors | LPC1313 - IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48, Microcontroller |
| LPC1313FHN33,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,ARM7 CPU,LLCC,32PIN,PLASTIC, Microcontroller |
| LPC1317FBD64,551 | NXP Semiconductors | LPC1317FBD64 - 32-bit ARM Cortex-M3 microcontroller; 64 kB flash; 10 kB SRAM; USART; EEPROM, SOT314-2 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1342FHN33,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,ARM7 CPU,LLCC,32PIN,PLASTIC, Microcontroller |
| LPC1343FBD48,151 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,ARM7 CPU,QFP,48PIN,PLASTIC, Microcontroller |
| LPC1343FHN33,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,ARM7 CPU,LLCC,32PIN,PLASTIC, Microcontroller |
| LPC1345FHN33,551 | NXP Semiconductors | LPC1345FHN33 - 32-bit ARM Cortex-M3 microcontroller; 32 kB flash; 10 kB SRAM; USB device; USART; EEPROM, SOT865-3 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1347FBD48,151 | NXP Semiconductors | LPC1347FBD48 - 32-bit ARM Cortex-M3 microcontroller; 64 kB flash; 12 kB SRAM; USB device; USART; EEPROM, SOT313-2 Package, Standard Marking, Tray Pack, Bakeable, Single |
| LPC1347FBD64,551 | NXP Semiconductors | LPC1347FBD64 - 32-bit ARM Cortex-M3 microcontroller; 64 kB flash; 12 kB SRAM; USB device; USART; EEPROM, SOT314-2 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC1517JBD48E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 48LQFP |
| LPC1517JBD64E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 64LQFP |
| LPC1518JBD64E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 64LQFP |
| LPC1519JBD64E | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 64LQFP |
| LPC1547JBD64QL | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 64LQFP |
| LPC1549JBD48QL | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 48LQFP |
| LPC1549JBD64QL | NXP Semiconductors | Embedded - Microcontrollers, Integrated Circuits (ICs), IC MCU 32BIT ARM 64LQFP |
| LPC1751FBD80,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,QFP,80PIN,PLASTIC, Microcontroller |
| LPC1752FBD80,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,QFP,80PIN,PLASTIC, Microcontroller |
| LPC1754FBD80,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,QFP,80PIN,PLASTIC, Microcontroller |
| LPC1756FBD80,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,QFP,80PIN,PLASTIC, Microcontroller |
| LPC1758FBD80,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,QFP,80PIN,PLASTIC, Microcontroller |
| LPC1759FBD80,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,QFP,80PIN,PLASTIC, Microcontroller |
| LPC1764FBD100,551 | NXP Semiconductors | LPC1764 - IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller |
| LPC1765FBD100,551 | NXP Semiconductors | LPC1765 - IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller |
| LPC1766FBD100,551 | NXP Semiconductors | LPC1766 - IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller |
| LPC1767FBD100,551 | NXP Semiconductors | LPC1767 - IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller |
| LPC1768FBD100,551 | NXP Semiconductors | LPC1768 - IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller |
| LPC1768FET100,551 | NXP Semiconductors | LPC1768 - IC 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-926-1, TFBGA-100, Microcontroller |
| LPC1769FBD100,551 | NXP Semiconductors | LPC1769 - IC 32-BIT, FLASH, 120 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100, Microcontroller |
| LPC1778FBD144,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,QFP,144PIN,PLASTIC, Microcontroller |
| LPC1778FBD208,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,QFP,208PIN,PLASTIC, Microcontroller |
| LPC1778FET180,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,BGA,180PIN,PLASTIC, Microcontroller |
| LPC1788FBD144,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,QFP,144PIN,PLASTIC, Microcontroller |
| LPC1788FBD208,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,QFP,208PIN,PLASTIC, Microcontroller |
| LPC1788FET180,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,BGA,180PIN,PLASTIC, Microcontroller |
| LPC1788FET208,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,BGA,208PIN,PLASTIC, Microcontroller |
| LPC1817JBD144E | NXP Semiconductors | LPC1817JBD144 - LPC1817JBD144 - 1024kB flash, 136kB SRAM, LQFP144 package |
| LPC1833JET100E | NXP Semiconductors | LPC1833JET100 - LPC1833JET100 - 512kB flash, 136kB SRAM, Ethernet, TFBGA100 package |
| LPC1837FET256,551 | NXP Semiconductors | LPC1837FET256 - LPC1837FET256 - 1024kB flash, 136kB SRAM, Ethernet, LBGA256 package |
| LPC1837JBD144E | NXP Semiconductors | LPC1837JBD144 - LPC1837JBD144 - 1024kB flash, 136kB SRAM, Ethernet, LQFP144 package |
| LPC1857FET256,551 | NXP Semiconductors | LPC1857FET256 - Cortex-M3, 1 MB dual-bank flash, 136 kB SRAM, 2 HS USB with on-chip PHY, Ethernet, LCD, CAN, AES, SPIFI, SCT, SOT740-2 Package, Standard Marking, Tray Dry Pack, Bakeable, Single |
| LPC2101FBD48,151 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC - ADCs: 8-ch/10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 14 ; Function: 16/32-bit uController ; I/O pins: 32 ; Memory size: 8K kBits; Memory type: FLASH ; Number of pins: 48 ; Operating frequency: 0 ~ 60 MHz; Operating temperature: -40 ~ +85 Cel; Power supply: 1.8V (CPU)3.3V (I/O) ; PWMs: N/A ; RAM: 2048 bytes; Reset active: Low ; Serial interface: 2xUART2xI2C2xSPI ; Series: LPC2100 family ; Special features: 0 WS Exec. from int. FlashJTAG ; System frequency: 0~60 MHz; Timers: 4x32-bit / 2x16-bit ; Watchdog timer: yes; Package: SOT313-2 (LQFP48); Container: Tray Pack, Bakeable, Single |
| LPC2102FBD48,151 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC - ADCs: 8-ch/10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 14 ; Function: 16/32-bit uController ; I/O pins: 32 ; Memory size: 16K kBits; Memory type: FLASH ; Number of pins: 48 ; Operating frequency: 0 ~ 60 MHz; Operating temperature: -40 ~ +85 Cel; Power supply: 1.8V (CPU)3.3V (I/O) ; PWMs: N/A ; RAM: 4096 bytes; Reset active: Low ; Serial interface: 2xUART2xI2C2xSPI ; Series: LPC2100 family ; Special features: 0 WS Exec. from int. FlashJTAG ; System frequency: 0~60 MHz; Timers: 4x32-bit / 2x16-bit ; Watchdog timer: yes; Package: SOT313-2 (LQFP48); Container: Tray Pack, Bakeable, Single |
| LPC2103FBD48,118 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC - ADCs: 8-ch/10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 14 ; Function: 16/32-bit uController ; I/O pins: 32 ; Memory size: 32K kBits; Memory type: FLASH ; Number of pins: 48 ; Operating frequency: 0 ~ 60 MHz; Operating temperature: -40 ~ +85 Cel; Power supply: 1.8V (CPU)3.3V (I/O) ; PWMs: N/A ; RAM: 8192 bytes; Reset active: Low ; Serial interface: 2xUART2xI2C2xSPI ; Series: LPC2100 family ; Special features: 0 WS Exec. from int. FlashJTAG ; System frequency: 0~60 MHz; Timers: 4x32-bit / 2x16-bit ; Watchdog timer: yes; Package: SOT313-2 (LQFP48); Container: Reel Pack, SMD, 13" |
| LPC2103FBD48,151 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC - ADCs: 8-ch/10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 14 ; Function: 16/32-bit uController ; I/O pins: 32 ; Memory size: 32K kBits; Memory type: FLASH ; Number of pins: 48 ; Operating frequency: 0 ~ 60 MHz; Operating temperature: -40 ~ +85 Cel; Power supply: 1.8V (CPU)3.3V (I/O) ; PWMs: N/A ; RAM: 8192 bytes; Reset active: Low ; Serial interface: 2xUART2xI2C2xSPI ; Series: LPC2100 family ; Special features: 0 WS Exec. from int. FlashJTAG ; System frequency: 0~60 MHz; Timers: 4x32-bit / 2x16-bit ; Watchdog timer: yes; Package: SOT313-2 (LQFP48); Container: Tray Pack, Bakeable, Single |
| LPC2104FBD48/01,15 | NXP Semiconductors | Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM; Package: SOT313-2 (LQFP48); Container: Tray Pack, Bakeable, Single |
| LPC2105FBD48/01,15 | NXP Semiconductors | Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM; Package: SOT313-2 (LQFP48); Container: Tray Pack, Bakeable, Single |
| LPC2106FBD48/01,15 | NXP Semiconductors | Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM; Package: SOT313-2 (LQFP48); Container: Tray Pack, Bakeable, Single |
| LPC2106FHN48/01,55 | NXP Semiconductors | Single-chip 32-bit microcontrollers; 128 kB ISP/IAP flash with 16/32/64 kB RAM; Package: SOT619-1 (HVQFN48); Container: Tray Dry Pack, Bakeable, Single |
| LPC2109FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash with 10-bit ADC and CAN; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2114FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2119FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash with 10-bit ADC and CAN; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2124FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2129FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 64/128/256 kB ISP/IAP flash with 10-bit ADC and CAN; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2131FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2132FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2134FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2136FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2138FBD64/01,11 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Reel Pack, SMD, 13" |
| LPC2138FBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2138FHN64/01,55 | NXP Semiconductors | Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT804-2 (HVQFN64); Container: Tray Dry Pack, Bakeable, Multiple |
| LPC2141FBD64,151 | NXP Semiconductors | LPC2141 - IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64, Microcontroller |
| LPC2142FBD64,151 | NXP Semiconductors | LPC2142 - IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64, Microcontroller |
| LPC2144FBD64,151 | NXP Semiconductors | LPC2144 - IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64, Microcontroller |
| LPC2146FBD64,151 | NXP Semiconductors | LPC2146 - IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64, Microcontroller |
| LPC2148FBD64,151 | NXP Semiconductors | LPC2148 - IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64, Microcontroller |
| LPC2194HBD64/01,15 | NXP Semiconductors | Single-chip 16/32-bit microcontroller; 256 kB ISP/IAP flash with 10-bit ADC and CAN; Package: SOT314-2 (LQFP64); Container: Tray Pack, Bakeable, Single |
| LPC2210FBD144/01,5 | NXP Semiconductors | 16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2212FBD144/01,5 | NXP Semiconductors | 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2214FBD144/01,5 | NXP Semiconductors | 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2220FBD144,551 | NXP Semiconductors | 16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface - ADCs: 8-ch 10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 3 ; Function: 16/32-bit uController ; I/O pins: 112 ; Memory size: - kBits; Memory type: ROMless ; Number of pins: 144 ; Operating frequency: 0~75 MHz; Operating temperature: -40 to +85 Cel; Power supply: 1.8V (CPU)3.3V (I/O) ; PWMs: 6-ch PWM ; RAM: 64KB bytes; Reset active: Low ; Serial interface: 2xUARTI2C1xSPI 1xSPI/SSP ; Series: LPC2200 family ; Special features: JTAG; ETM ; System frequency: 0~60 MHz; Timers: 4 x 32-bit ; Watchdog timer: yes; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2220FET144/G,55 | NXP Semiconductors | 16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface; Package: SOT569-2 (TFBGA144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2292FBD144/01,5 | NXP Semiconductors | 16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2292FET144/01,5 | NXP Semiconductors | 16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface; Package: SOT569-2 (TFBGA144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2294HBD144/01,5 | NXP Semiconductors | 16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2361FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC; Package: SOT407-1 (LQFP100); Container: Tray Dry Pack, Bakeable, Single |
| LPC2362FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC; Package: SOT407-1 (LQFP100); Container: Tray Dry Pack, Bakeable, Single |
| LPC2364FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single |
| LPC2365FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single |
| LPC2366FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single |
| LPC2367FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single |
| LPC2368FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC, SOT407-1 (LQFP100), Tray Dry Pack, Bakeable, Single |
| LPC2368FET100,518 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC, SOT926-1 (TFBGA100), Reel Dry Pack, SMD, 13" |
| LPC2377FBD144,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontroller; 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2378FBD144,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontroller; 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC - ADCs: 8-ch 10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 46 ; Function: 16/32-bit uController ; I/O pins: 104 ; Memory size: 512KB kBits; Memory type: FLASH ; Number of pins: 144 ; Operating frequency: 0~72 MHz; Operating temperature: -40 to +85 Cel; Power supply: 3.3V ; PWMs: 6-ch PWM ; RAM: 58KB bytes; Reset active: Low ; Serial interface: USB 2.010/100 ENET2xCAN1xI2S4xUART3xI2C3xSPI ; Series: LPC2300 family ; Special features: 4MHz IRCENET+CAN+USBSD/MMC ; System frequency: 0~72 MHz; Timers: 6 x 32-bit ; Watchdog timer: yes; Package: SOT486-1 (LQFP144); Container: Tray Dry Pack, Bakeable, Single |
| LPC2387FBD100,551 | NXP Semiconductors | Single-chip 16-bit/32-bit microcontrollers; 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC; Package: SOT407-1 (LQFP100); Container: Tray Dry Pack, Bakeable, Single |
| LPC2388FBD144,551 | NXP Semiconductors | Single-chip 16-bit/32-bit micro; 512 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC, SOT486-1 (LQFP144), Tray Dry Pack, Bakeable, Single |
| LPC2420FBD208,551 | NXP Semiconductors | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface; Package: SOT459-1 (LQFP208); Container: Tray Dry Pack, Bakeable, Single |
| LPC2460FBD208,551 | NXP Semiconductors | Flashless 16-bit/32-bit micro; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface; Package: SOT459-1 (LQFP208); Container: Tray Dry Pack, Bakeable, Single |
| LPC2460FET208,551 | NXP Semiconductors | Flashless 16-bit/32-bit micro; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface; Package: SOT950-1 (TFBGA208); Container: Tray Dry Pack, Bakeable, Single |
| LPC2468FBD208,551 | NXP Semiconductors | Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface - ADCs: 8-ch 10-bit ; Category: ARM7TDMI-S Core ; Clock type: N/A ; External interrupt: 46 ; Function: 16/32-bit uController ; I/O pins: 160 ; Memory size: 512KB kBits; Memory type: FLASH ; Number of pins: 208 ; Operating frequency: 0~72 MHz; Operating temperature: -40 to +85 Cel; Power supply: 3.3V ; PWMs: 2x 6-ch PWM ; RAM: 98KB bytes; Reset active: Low ; Serial interface: USB 2.0 Host/Dev/OTG10/100 ENET2xCAN1xI2S4xUART3xI2C3xSPI ; Series: LPC2400 family ; Special features: 4MHz IRCENET+CAN+USBSD/MMC ; System frequency: 0~72 MHz; Timers: 6 x 32-bit ; Watchdog timer: yes; Package: SOT459-1 (LQFP208); Container: Tray Dry Pack, Bakeable, Single |
| LPC2468FET208,551 | NXP Semiconductors | Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface; Package: SOT950-1 (TFBGA208); Container: Tray Dry Pack, Bakeable, Single |
| LPC2470FBD208,551 | NXP Semiconductors | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single |
| LPC2470FET208,551 | NXP Semiconductors | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT950-1 (TFBGA208), Tray Dry Pack, Bakeable, Single |
| LPC2478FBD208,551 | NXP Semiconductors | Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single |
| LPC2478FET208,551 | NXP Semiconductors | Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, LCD, USB 2.0 device/host/OTG, external memory interface, SOT950-1 (TFBGA208), Tray Dry Pack, Bakeable, Single |
| LPC2939FBD208,551 | NXP Semiconductors | ARM9 microcontroller with CAN, LIN, and USB, SOT459-1 (LQFP208), Tray Dry Pack, Bakeable, Single |
| LPC3130FET180,551 | NXP Semiconductors | Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller, SOT570-3 (TFBGA180), Tray Dry Pack, Bakeable, Single |
| LPC3131FET180,551 | NXP Semiconductors | Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controller, SOT570-3 (TFBGA180), Tray Dry Pack, Bakeable, Single |
| LPC3180FEL320/01,5 | NXP Semiconductors | LPC3180 - IC 32-BIT, FLASH, 208 MHz, RISC MICROCONTROLLER, PBGA320, 13 X 13 MM, 0.90 MM HEIGHT, PLASTIC, SOT-824-1, LFBGA-320, Microcontroller |
| LPC3250FET296/01,5 | NXP Semiconductors | LPC3250 - IC 32-BIT, FLASH, 266 MHz, RISC MICROCONTROLLER, PBGA296, 15 X 15 MM, 0.70 MM PITCH, ROHS COMPLIANT, PLASTIC, MO-216, SOT1048-1, TFBGA-296, Microcontroller |
| LPC4074FBD80,551 | NXP Semiconductors | LPC4074FBD80 - LPC4074FBD80 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI |
| LPC4076FET180,551 | NXP Semiconductors | LPC4076FET180 - LPC4076FET180 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI |
| LPC4078FBD100E | NXP Semiconductors | LPC4078FBD100 - LPC4078FBD100 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI |
| LPC4078FBD144,551 | NXP Semiconductors | LPC4078FBD144 - LPC4078FBD144 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI |
| LPC4078FBD208,551 | NXP Semiconductors | LPC4078FBD208 - LPC4078FBD208 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI |
| LPC4078FBD80,551 | NXP Semiconductors | LPC4078FBD80 - LPC4078FBD80 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI |
| LPC4088FBD144,551 | NXP Semiconductors | LPC4088FBD144 - LPC4088FBD144 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC; SPIFI |
| LPC4088FBD208,551 | NXP Semiconductors | LPC4088FBD208 - LPC4088FBD208 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC; SPIFI |
| LPC4088FET180,551 | NXP Semiconductors | LPC4088FET180 - LPC4088FET180 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC; SPIFI |
| LPC4088FET208,551 | NXP Semiconductors | LPC4088FET208 - LPC4088FET208 - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC; SPIFI |
| LPC4320FET100,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,BGA,100PIN,PLASTIC, Microcontroller |
| LPC4322JET100E | NXP Semiconductors | LPC4322JET100 - LPC4322JET100 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; two High-speed USB, LCD, EMC |
| LPC4323JBD144E | NXP Semiconductors | LPC4323JBD144 - LPC4323JBD144 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; two High-speed USB, LCD, EMC |
| LPC4330FBD144,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,QFP,144PIN,PLASTIC, Microcontroller |
| LPC4330FET100,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,BGA,100PIN,PLASTIC, Microcontroller |
| LPC4333JBD144E | NXP Semiconductors | LPC4333JBD144 - LPC4333JBD144 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC |
| LPC4337FET256,551 | NXP Semiconductors | LPC4337FET256 - LPC4337FET256 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC |
| LPC4337JBD144E | NXP Semiconductors | LPC4337JBD144 - LPC4337JBD144 - 32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC |
| LPC4350FET256,551 | NXP Semiconductors | IC IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,BGA,256PIN,PLASTIC, Microcontroller |
Each PDF datasheet is copyright by its repective electronic component manufacturer: NXP Semiconductors